Issued Patents All Time
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7351131 | Method for manufacturing semiconductor device and polishing apparatus | Kenro Nakamura, Takashi Yoda, Katsuya Okumura | 2008-04-01 |
| 7246079 | Method of predicting initial input of new product, system for predicting initial input of new product, and recording medium | Hideyuki Ando, Takashi Kanazawa, Koji Nishimoto | 2007-07-17 |
| 7101259 | Polishing method and apparatus | Norio Kimura, Mitsuhiko Shirakashi, Katsuhiko Tokushige, Masao Asami, Masako Kodera +3 more | 2006-09-05 |
| 7005382 | Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing | Kazuo Nishimoto, Tatsuaki Sakano, Akihiro Takemura, Masayuki Hattori, Nobuo Kawahashi +3 more | 2006-02-28 |
| 6933234 | Method for manufacturing semiconductor device and polishing apparatus | Kenro Nakamura, Takashi Yoda, Katsuya Okumura | 2005-08-23 |
| 6867138 | Method of chemical/mechanical polishing of the surface of semiconductor device | Takeshi Nishioka | 2005-03-15 |
| 6783658 | Electropolishing method | Yoshitaka Matsui, Hiroshi Kosukegawa, Masako Kodera | 2004-08-31 |
| 6723226 | Method and apparatus for forming electrolytic water and apparatus for washing semiconductor substrate using electrolytic water-forming apparatus | Jun Takayasu, Mikiko Kawaguchi | 2004-04-20 |
| 6716087 | Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus | Yoshihiro Minami | 2004-04-06 |
| 6667238 | Polishing method and apparatus | Norio Kimura, Mitsuhiko Shirakashi, Katsuhiko Tokushige, Masao Asami, Masako Kodera +3 more | 2003-12-23 |
| 6468911 | Method of chemical/mechanical polishing of the surface of semiconductor device | Takeshi Nishioka | 2002-10-22 |
| 6354913 | Abrasive and method for polishing semiconductor substrate | Yoshihiro Minami, Kenji Doi, Jun Takayasu, Hiroyuki Kohno, Hiroshi Kato +1 more | 2002-03-12 |
| 6241581 | Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus | Yoshihiro Minami | 2001-06-05 |
| 6167583 | Double side cleaning apparatus for semiconductor substrate | Masahiro Abe | 2001-01-02 |
| 6098638 | Method of manufacturing a semiconductor device and an apparatus for manufacturing the same | Jun Takayasu, Mariko Shimomura | 2000-08-08 |
| 6069083 | Polishing method, semiconductor device fabrication method, and semiconductor fabrication apparatus | Masahiro Abe, Mariko Shimomura | 2000-05-30 |
| 6045605 | Abrasive material for polishing a semiconductor wafer, and methods for manufacturing and using the abrasive material | Kenji Doi, Masahiro Abe, Hiroyuki Kohno, Hiroshi Kato, Kazuhiko Hayashi | 2000-04-04 |
| 6007696 | Apparatus and method for manufacturing electrolytic ionic water and washing method using electroyltic ionic water | Jun Takayasu | 1999-12-28 |
| 6001238 | Method for purifying pure water and an apparatus for the same | Jun Takayasu | 1999-12-14 |
| 5993639 | Method for producing electrolytic ionic water and an apparatus for the same | Masahiro Abe | 1999-11-30 |
| 5968239 | Polishing slurry | Masahiro Abe, Mariko Shimomura | 1999-10-19 |
| RE36328 | Semiconductor manufacturing apparatus including temperature control mechanism | Koichi Takahashi, Hiroshi Kinoshita | 1999-10-05 |
| 5943578 | Method of manufacturing a semiconductor device having an element isolating region | Ichiro Katakabe, Hiroshi Kawamoto | 1999-08-24 |
| 5922620 | Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus | Mariko Shimomura, Hiroyuki Ohashi | 1999-07-13 |
| 5880032 | Method and apparatus for manufacturing a semiconductor device | Kenji Doi, Ichiro Katakabe | 1999-03-09 |