Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6800188 | Copper plating bath and plating method for substrate using the copper plating bath | Hideki Hagiwara, Ryoichi Kimizuka, Megumi Maruyama, Takashi Miyake, Hiroshi Nagasawa +2 more | 2004-10-05 |
| 6193789 | Electroless copper plating solution and method for electroless copper plating | Hideo Honma, Tomoyuki Fujinami, Shinji Hayashi, Satoru Shimizu | 2001-02-27 |