TF

Tomoyuki Fujinami

EC Ebara-Udylite Co.: 2 patents #3 of 32Top 10%
UN Unknown: 2 patents #12,644 of 83,584Top 20%
EL Electroplating Engineers Of Japan Limited: 1 patents #16 of 29Top 60%
Overall (All Time): #1,532,696 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
8771409 Electroless gold plating solution and electroless gold plating method Takanobu Asakawa 2014-07-08
6329072 Microporous copper film and electroless copper plating solution for obtaining the same Hideo Honma, Nobuo Ebina 2001-12-11
6193789 Electroless copper plating solution and method for electroless copper plating Hideo Honma, Yoshitaka Terashima, Shinji Hayashi, Satoru Shimizu 2001-02-27