Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7678258 | Void-free damascene copper deposition process and means of monitoring thereof | Panayotis Andricacos, Hariklia Deligianni, James E. Fluegel, Keith Kwietniak, Peter S. Locke +4 more | 2010-03-16 |
| 7227265 | Electroplated copper interconnection structure, process for making and electroplating bath | Panayotis Andricacos, Steven H. Boettcher, Hariklia Deligianni, James E. Fluegel, Wilma Jean Horkans +6 more | 2007-06-05 |
| 6605534 | Selective deposition of a conductive material | David V. Horak, Erick G. Walton | 2003-08-12 |
| 6409903 | Multi-step potentiostatic/galvanostatic plating control | Josef W. Korejwa, Erick G. Walton | 2002-06-25 |
| 6270646 | Electroplating apparatus and method using a compressible contact | Erick G. Walton, Lara Sandra Collins, William E. Corbin, Jr., Hariklia Deligianni, Daniel C. Edelstein +4 more | 2001-08-07 |