Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8803318 | Semiconductor chips including passivation layer trench structure | Deepak Kulkarni, Satyanayana V. Nitta, Shom Ponoth | 2014-08-12 |
| 8440505 | Semiconductor chips including passivation layer trench structure | Deepak Kulkarni, Satyanarayana V. Nitta, Shom Ponoth | 2013-05-14 |
| 8343868 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2013-01-01 |
| 8129286 | Reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2012-03-06 |
| 8101236 | Method of fabricating a SiCOH dielectric material with improved toughness and improved Si-C bonding | Daniel C. Edelstein, Stephen M. Gates, Alfred Grill, Qinghuang Lin, Robert D. Miller +2 more | 2012-01-24 |
| 8076756 | Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures | Xiao Hu Liu, Thomas M. Shaw, Mukta G. Farooq, Robert Hannon, Ian D. Melville | 2011-12-13 |
| 7955955 | Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures | Xiao Hu Liu, Thomas M. Shaw, Mukta G. Farooq, Robert Hannon, Ian D. Melville | 2011-06-07 |
| 7892940 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2011-02-22 |
| 7892648 | SiCOH dielectric material with improved toughness and improved Si-C bonding | Daniel C. Edelstein, Stephen M. Gates, Alfred Grill, Robert D. Miller, Deborah A. Neumayer +1 more | 2011-02-22 |
| 7847402 | BEOL interconnect structures with improved resistance to stress | Darryl D. Restaino, Griselda Bonilla, Christos D. Dimitrakopoulos, Stephen M. Gates, Jae Hak Kim +4 more | 2010-12-07 |
| 7825516 | Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures | Stefanie Chiras, Sandra G. Malhotra, Fenton R. Mc Feely, Robert Rosenberg, Carlos J. Sambucetti +1 more | 2010-11-02 |
| 7820559 | Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer | Lawrence A. Clevenger, Stefanie Chiras, Timothy J. Dalton, James J. Demarest, Darren N. Dunn +7 more | 2010-10-26 |
| 7704876 | Dual damascene interconnect structures having different materials for line and via conductors | Jeffrey P. Gambino, Edward C. Cooney, III, Anthony K. Stamper, William T. Motsiff, Andrew H. Simon | 2010-04-27 |
| 7678673 | Strengthening of a structure by infiltration | Elbert E. Huang, William Francis Landers, Eric G. Liniger, Xiao Hu Liu, David L. Questad +1 more | 2010-03-16 |
| 7592685 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2009-09-22 |
| 7573130 | Crack trapping and arrest in thin film structures | Thomas M. Shaw, Xio Hu Liu, Griselda Bonilla, James P. Doyle, Howard S. Landis +1 more | 2009-08-11 |
| 7517790 | Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification | John A. Fitzsimmons, Stephen M. Gates, Eric G. Liniger | 2009-04-14 |
| 7495338 | Metal capped copper interconnect | Stefanie Chiras, Terry A. Spooner, Robert Rosenberg, Daniel C. Edelstein | 2009-02-24 |
| 7491578 | Method of forming crack trapping and arrest in thin film structures | Thomas M. Shaw, Xio Hu Liu, Griselda Bonilla, James P. Doyle, Howard S. Landis +1 more | 2009-02-17 |
| 7485582 | Hardmask for improved reliability of silicon based dielectrics | Son V. Nguyen, Stephen M. Gates, Xiao Hu Liu, Vincent J. McGahay, Sanjay C. Mehta +1 more | 2009-02-03 |
| 7479306 | SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same | Daniel C. Edelstein, Stephen M. Gates, Alfred Grill, Qinghuang Lin, Robert D. Miller +2 more | 2009-01-20 |
| 7405147 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2008-07-29 |
| 7402532 | Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer | Lawrence A. Clevenger, Stefanie Chiras, Timothy J. Dalton, James J. Demarest, Derren N. Dunn +7 more | 2008-07-22 |
| 7357977 | Ultralow dielectric constant layer with controlled biaxial stress | Christos D. Dimitrakopoulos, Stephen M. Gates, Alfred Grill, Eric G. Liniger, Xiao Hu Liu +3 more | 2008-04-15 |
| 7335980 | Hardmask for reliability of silicon based dielectrics | Son V. Nguyen, Stephen M. Gates, Xiao Hu Liu, Vincent J. McGahay, Sanjay C. Mehta +1 more | 2008-02-26 |