Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7300867 | Dual damascene interconnect structures having different materials for line and via conductors | Jeffrey P. Gambino, Edward C. Cooney, III, Anthony K. Stamper, William T. Motsiff, Andrew H. Simon | 2007-11-27 |
| 7276787 | Silicon chip carrier with conductive through-vias and method for fabricating same | Daniel C. Edelstein, Paul S. Andry, Leena Paivikki Buchwalter, Jon A. Casey, Sherif A. Goma +9 more | 2007-10-02 |
| 7214608 | Interlevel dielectric layer and metal layer sealing | Matthew S. Angyal, Peter Biolsi, Lawrence A. Clevenger, Habib Hichri, Bernd Kastenmeier +3 more | 2007-05-08 |
| 7119018 | Copper conductor | Stefanie Chiras, Terry A. Spooner, Robert Rosenberg, Daniel C. Edelstein | 2006-10-10 |
| 7109093 | Crackstop with release layer for crack control in semiconductors | John A. Fitzsimmons, Vincent J. McGahay, Thomas M. Shaw, Anthony K. Stamper | 2006-09-19 |
| 7102232 | Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer | Lawrence A. Clevenger, Stefanie Chiras, Timothy J. Dalton, James J. Demarest, Derren N. Dunn +7 more | 2006-09-05 |
| 7084479 | Line level air gaps | Shyng-Tsong Chen, Stefanie Chiras, Matthew E. Colburn, Timothy J. Dalton, Jeffrey Hedrick +9 more | 2006-08-01 |
| 6974531 | Method for electroplating on resistive substrates | Panayotis Andricacos, Hariklia Deligianni, Wilma Jean Horkans, Keith Kwietniak, Sandra G. Malhotra +4 more | 2005-12-13 |
| 6972209 | Stacked via-stud with improved reliability in copper metallurgy | Birendra Agarwala, Conrad A. Barile, Hormazdyar M. Dalal, Brett H. Engle, Ernest N. Levine +8 more | 2005-12-06 |
| 6958540 | Dual damascene interconnect structures having different materials for line and via conductors | Jeffrey P. Gambino, Edward C. Cooney, III, Anthony K. Stamper, William T. Motsiff, Andrew H. Simon | 2005-10-25 |
| 6812143 | Process of forming copper structures | Fenton R. McFeely, Conal E. Murray, Robert Rosenberg | 2004-11-02 |
| 6787912 | Barrier material for copper structures | Fenton R. McFeely, Conal E. Murray, Robert Rosenberg | 2004-09-07 |
| 6764774 | Structures with improved adhesion to Si and C containing dielectrics and method for preparing the same | Alfred Grill, Vishnubhai V. Patel | 2004-07-20 |