| 10439547 |
Framed modular ballast block and method of construction |
— |
2019-10-08 |
|
| D749877 |
Table top cover |
— |
2016-02-23 |
|
| 7825516 |
Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures |
Stefanie Chiras, Michael Lane, Sandra G. Malhotra, Fenton R. Mc Feely, Carlos J. Sambucetti +1 more |
2010-11-02 |
$3,442,000 |
| 7495338 |
Metal capped copper interconnect |
Michael Lane, Stefanie Chiras, Terry A. Spooner, Daniel C. Edelstein |
2009-02-24 |
$4,380,000 |
| 7468320 |
Reduced electromigration and stressed induced migration of copper wires by surface coating |
Chao-Kun Hu, Judith M. Rubino, Carlos J. Sambucetti, Anthony K. Stamper |
2008-12-23 |
$10,467,000 |
| 7172968 |
Ultra thin, single phase, diffusion barrier for metal conductors |
Stephan A. Cohen, Fenton R. McFeely, Cevdet I. Noyan, Kenneth P. Rodbell, John J. Yurkas |
2007-02-06 |
$8,225,000 |
| 7119018 |
Copper conductor |
Michael Lane, Stefanie Chiras, Terry A. Spooner, Daniel C. Edelstein |
2006-10-10 |
$5,276,000 |
| 6831364 |
Method for forming a porous dielectric material layer in a semiconductor device and device formed |
Timothy J. Dalton, Stephen E. Greco, Jeffrey Hedrick, Satyanarayana V. Nitta, Sampath Purushothaman +1 more |
2004-12-14 |
$7,399,000 |
| 6812143 |
Process of forming copper structures |
Michael Lane, Fenton R. McFeely, Conal E. Murray |
2004-11-02 |
$9,962,000 |
| 6787912 |
Barrier material for copper structures |
Michael Lane, Fenton R. McFeely, Conal E. Murray |
2004-09-07 |
$9,920,000 |
| 6777809 |
BEOL decoupling capacitor |
Peter Richard Duncombe, Daniel C. Edelstein, Robert Benjamin Laibowitz, Deborah A. Neumayer, Tak H. Ning +1 more |
2004-08-17 |
$5,840,000 |
| D476726 |
Combined air freshener and picture frame |
— |
2003-07-01 |
|
| 6525427 |
BEOL decoupling capacitor |
Peter Richard Duncombe, Daniel C. Edelstein, Robert Benjamin Laibowitz, Deborah A. Neumayer, Tak H. Ning +1 more |
2003-02-25 |
$14,577,000 |
| 6503641 |
Interconnects with Ti-containing liners |
Cyril Cabral, Jr., Roy A. Carruthers, James M. E. Harper, Chao-Kun Hu, Kim Y. Lee +2 more |
2003-01-07 |
$16,905,000 |
| 6451712 |
Method for forming a porous dielectric material layer in a semiconductor device and device formed |
Timothy J. Dalton, Stephen E. Greco, Jeffrey Hedrick, Satyanarayana V. Nitta, Sampath Purushothaman +1 more |
2002-09-17 |
$8,846,000 |
| 6452276 |
Ultra thin, single phase, diffusion barrier for metal conductors |
Stephan A. Cohen, Fenton R. McFeely, Cevdet I. Noyan, Kenneth P. Rodbell, John J. Yurkas |
2002-09-17 |
$8,846,000 |
| 6417572 |
Process for producing metal interconnections and product produced thereby |
Dureseti Chidambarrao, Ronald G. Filippi, Thomas M. Shaw, Timothy D. Sullivan, Richard A. Wachnik |
2002-07-09 |
$13,596,000 |
| 6342733 |
Reduced electromigration and stressed induced migration of Cu wires by surface coating |
Chao-Kun Hu, Judith M. Rubino, Carlos J. Sambucetti, Anthony K. Stamper |
2002-01-29 |
$17,392,000 |
| 6264885 |
Metal/ferrite laminate magnet |
John U. Knickerbocker, Andrew Ramsay Knox |
2001-07-24 |
$31,737,000 |
| 5986395 |
Metal/ferrite laminate magnet |
John U. Knickerbocker, Andrew Ramsay Knox |
1999-11-16 |
$28,261,000 |
| 5857883 |
Method of forming perforated metal/ferrite laminated magnet |
John U. Knickerbocker, James N. Humenik, Andrew Ramsay Knox |
1999-01-12 |
$24,935,000 |
| 5540785 |
Fabrication of defect free silicon on an insulating substrate |
Robert H. Dennard, Bernard S. Meyerson |
1996-07-30 |
$12,111,000 |
| 5462883 |
Method of fabricating defect-free silicon on an insulating substrate |
Robert H. Dennard, Bernard S. Meyerson |
1995-10-31 |
$8,032,000 |
| 5359678 |
Apparatus and method employing fast polarization modulation to reduce effects of polarization hole burning and/or polarization dependent loss |
Fred L. Heismann |
1994-10-25 |
|
| 5327511 |
Apparatus and method employing fast polarization modulation to reduce effects of polarization hole burning and polarization dependent loss |
Fred L. Heismann |
1994-07-05 |
|
