Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures

Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures

US Patent 7825516 · Granted Nov 2, 2010

Estimated economic value: $3,442,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Transforming a valve metal layer into a template comprising a plurality of space2023
3D ordered nanomesh for metal-air battery2023
Solid electrolyte, electrode, power storage device, and method for producing sol2023
Solid electrolyte, electrode, power storage device, and method for producing sol2023
Solid nanocomposite electrolyte materials2023
Porous solid materials and methods for fabrication2023
Solid electrolyte, electrode, power storage device, and method for producing sol2023
Synthesis device2022
Hybrid nanolaminate electrodes for Li-ion batteries2021
Solid electrolyte, electrode, and power storage device2021
Fabrication of solid-state battery cells and solid-state batteries2021
Ion insertion battery electrode and method of fabricating same2020