Issued Patents All Time
Showing 25 most recent of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8125082 | Reduction of silicide formation temperature on SiGe containing substrates | Cyril Cabral, Jr., Roy A. Carruthers, Jia Chen, Christopher G. M. M. Detavernier, Christian Lavoie | 2012-02-28 |
| 7468766 | Reflective spatial light modulator array including a light blocking layer | Evan G. Colgan, Frank B. Kaufman, Margaret Paggi Manny, Robert L. Melcher, James L. Speidell | 2008-12-23 |
| 7384868 | Reduction of silicide formation temperature on SiGe containing substrates | Cyril Cabral, Jr., Roy A. Carruthers, Jia Chen, Christophe Detavernier, Christian Lavoie | 2008-06-10 |
| 7271486 | Retarding agglomeration of Ni monosilicide using Ni alloys | Cyril Cabral, Jr., Roy A. Carruthers, Christophe Detavernier, Christian Lavoie | 2007-09-18 |
| 7102234 | Method and structure for reduction of contact resistance of metal silicides using a metal-germanium alloy | Cyril Cabral, Jr., Roy A. Carruthers, Christian Lavoie, Ronnen Andrew Roy, Yun-Yu Wang | 2006-09-05 |
| 7081676 | Structure for controlling the interface roughness of cobalt disilicide | Paul D. Agnello, Cyril Cabral, Jr., Roy A. Carruthers, Christian Lavoie, Kirk D. Peterson +4 more | 2006-07-25 |
| 6905560 | Retarding agglomeration of Ni monosilicide using Ni alloys | Cyril Cabral, Jr., Roy A. Carruthers, Christophe Detavernier, Christian Lavoie | 2005-06-14 |
| 6809030 | Method and structure for controlling the interface roughness of cobalt disilicide | Paul D. Agnello, Cyril Cabral, Jr., Roy A. Carruthers, Christian Lavoie, Kirk D. Peterson +4 more | 2004-10-26 |
| 6753606 | Method and structure for reduction of contact resistance of metal silicides using a metal-germanium alloy | Cyril Cabral, Jr., Roy A. Carruthers, Christian Lavoie, Ronnen Andrew Roy, Yun-Yu Wang | 2004-06-22 |
| 6503641 | Interconnects with Ti-containing liners | Cyril Cabral, Jr., Roy A. Carruthers, Chao-Kun Hu, Kim Y. Lee, Ismail C. Noyan +2 more | 2003-01-07 |
| 6444578 | Self-aligned silicide process for reduction of Si consumption in shallow junction and thin SOI electronic devices | Cyril Cabral, Jr., Roy A. Carruthers, Kevin K. Chan, Guy M. Cohen, Kathryn Guarini +2 more | 2002-09-03 |
| 6440851 | Method and structure for controlling the interface roughness of cobalt disilicide | Paul D. Agnello, Cyril Cabral, Jr., Roy A. Carruthers, Christian Lavoie, Kirk D. Peterson +4 more | 2002-08-27 |
| 6424388 | Reflective spatial light modulator array | Evan G. Colgan, Frank B. Kaufman, Margaret Paggi Manny, Robert L. Melcher, James L. Speidell | 2002-07-23 |
| 6413859 | Method and structure for retarding high temperature agglomeration of silicides using alloys | Cyril Cabral, Jr., Roy A. Carruthers, Paul Kozlowski, Christian Lavoie, Joseph S. Newbury +1 more | 2002-07-02 |
| 6399496 | Copper interconnection structure incorporating a metal seed layer | Daniel C. Edelstein, Chao-Kun Hu, Andrew H. Simon, Cyprian Emeka Uzoh | 2002-06-04 |
| 6346175 | Modification of in-plate refractory metal texture by use of refractory metal/nitride layer | Evan G. Colgan, Kenneth P. Rodbell, Hiroshi Takatsuji | 2002-02-12 |
| 6331486 | Method and structure for reduction of contact resistance of metal silicides using a metal-germanium alloy | Cyril Cabral, Jr., Roy A. Carruthers, Christian Lavoie, Ronnen Andrew Roy, Yun-Yu Wang | 2001-12-18 |
| 6323130 | Method for self-aligned formation of silicide contacts using metal silicon alloys for limited silicon consumption and for reduction of bridging | Stephen Bruce Brodsky, Cyril Cabral, Jr., Roy A. Carruthers, Christian Lavoie, Patricia A. O'Neil +1 more | 2001-11-27 |
| 6300236 | Copper stud structure with refractory metal liner | Robert M. Geffken | 2001-10-09 |
| 6187679 | Low temperature formation of low resistivity titanium silicide | Cyril Cabral, Jr., Lawrence A. Clevenger, Francois M. d'Heurle, Randy W. Mann, Glen L. Miles +3 more | 2001-02-13 |
| 6181012 | Copper interconnection structure incorporating a metal seed layer | Daniel C. Edelstein, Chao-Kun Hu, Andrew H. Simon, Cyprian Emeka Uzoh | 2001-01-30 |
| 6150723 | Copper stud structure with refractory metal liner | Robert M. Geffken | 2000-11-21 |
| 6090710 | Method of making copper alloys for chip and package interconnections | Panayotis Andricacos, Hariklia Deligianni, Chao-Kun Hu, Dale J. Pearson, Scott K. Reynolds +2 more | 2000-07-18 |
| 6063506 | Copper alloys for chip and package interconnections | Panayotis Andricacos, Hariklia Deligianni, Chao-Kun Hu, Dale J. Pearson, Scott K. Reynolds +2 more | 2000-05-16 |
| 5911619 | Apparatus for electrochemical mechanical planarization | Cyprian Emeka Uzoh | 1999-06-15 |