| 8125082 |
Reduction of silicide formation temperature on SiGe containing substrates |
Cyril Cabral, Jr., Roy A. Carruthers, Jia Chen, Christopher G. M. M. Detavernier, Christian Lavoie |
2012-02-28 |
$6,579,000 |
| 7468766 |
Reflective spatial light modulator array including a light blocking layer |
Evan G. Colgan, Frank B. Kaufman, Margaret Paggi Manny, Robert L. Melcher, James L. Speidell |
2008-12-23 |
$10,467,000 |
| 7384868 |
Reduction of silicide formation temperature on SiGe containing substrates |
Cyril Cabral, Jr., Roy A. Carruthers, Jia Chen, Christophe Detavernier, Christian Lavoie |
2008-06-10 |
$5,963,000 |
| 7271486 |
Retarding agglomeration of Ni monosilicide using Ni alloys |
Cyril Cabral, Jr., Roy A. Carruthers, Christophe Detavernier, Christian Lavoie |
2007-09-18 |
$6,075,000 |
| 7102234 |
Method and structure for reduction of contact resistance of metal silicides using a metal-germanium alloy |
Cyril Cabral, Jr., Roy A. Carruthers, Christian Lavoie, Ronnen Andrew Roy, Yun-Yu Wang |
2006-09-05 |
$3,397,000 |
| 7081676 |
Structure for controlling the interface roughness of cobalt disilicide |
Paul D. Agnello, Cyril Cabral, Jr., Roy A. Carruthers, Christian Lavoie, Kirk D. Peterson +4 more |
2006-07-25 |
$9,389,000 |
| 6905560 |
Retarding agglomeration of Ni monosilicide using Ni alloys |
Cyril Cabral, Jr., Roy A. Carruthers, Christophe Detavernier, Christian Lavoie |
2005-06-14 |
$9,509,000 |
| 6809030 |
Method and structure for controlling the interface roughness of cobalt disilicide |
Paul D. Agnello, Cyril Cabral, Jr., Roy A. Carruthers, Christian Lavoie, Kirk D. Peterson +4 more |
2004-10-26 |
$17,835,000 |
| 6753606 |
Method and structure for reduction of contact resistance of metal silicides using a metal-germanium alloy |
Cyril Cabral, Jr., Roy A. Carruthers, Christian Lavoie, Ronnen Andrew Roy, Yun-Yu Wang |
2004-06-22 |
$6,022,000 |
| 6503641 |
Interconnects with Ti-containing liners |
Cyril Cabral, Jr., Roy A. Carruthers, Chao-Kun Hu, Kim Y. Lee, Ismail C. Noyan +2 more |
2003-01-07 |
$16,905,000 |
| 6444578 |
Self-aligned silicide process for reduction of Si consumption in shallow junction and thin SOI electronic devices |
Cyril Cabral, Jr., Roy A. Carruthers, Kevin K. Chan, Guy M. Cohen, Kathryn Guarini +2 more |
2002-09-03 |
$9,688,000 |
| 6440851 |
Method and structure for controlling the interface roughness of cobalt disilicide |
Paul D. Agnello, Cyril Cabral, Jr., Roy A. Carruthers, Christian Lavoie, Kirk D. Peterson +4 more |
2002-08-27 |
$8,564,000 |
| 6424388 |
Reflective spatial light modulator array |
Evan G. Colgan, Frank B. Kaufman, Margaret Paggi Manny, Robert L. Melcher, James L. Speidell |
2002-07-23 |
$13,664,000 |
| 6413859 |
Method and structure for retarding high temperature agglomeration of silicides using alloys |
Cyril Cabral, Jr., Roy A. Carruthers, Paul Kozlowski, Christian Lavoie, Joseph S. Newbury +1 more |
2002-07-02 |
$11,850,000 |
| 6399496 |
Copper interconnection structure incorporating a metal seed layer |
Daniel C. Edelstein, Chao-Kun Hu, Andrew H. Simon, Cyprian Emeka Uzoh |
2002-06-04 |
$11,648,000 |
| 6346175 |
Modification of in-plate refractory metal texture by use of refractory metal/nitride layer |
Evan G. Colgan, Kenneth P. Rodbell, Hiroshi Takatsuji |
2002-02-12 |
$23,472,000 |
| 6331486 |
Method and structure for reduction of contact resistance of metal silicides using a metal-germanium alloy |
Cyril Cabral, Jr., Roy A. Carruthers, Christian Lavoie, Ronnen Andrew Roy, Yun-Yu Wang |
2001-12-18 |
$52,171,000 |
| 6323130 |
Method for self-aligned formation of silicide contacts using metal silicon alloys for limited silicon consumption and for reduction of bridging |
Stephen Bruce Brodsky, Cyril Cabral, Jr., Roy A. Carruthers, Christian Lavoie, Patricia A. O'Neil +1 more |
2001-11-27 |
$23,652,000 |
| 6300236 |
Copper stud structure with refractory metal liner |
Robert M. Geffken |
2001-10-09 |
$29,916,000 |
| 6187679 |
Low temperature formation of low resistivity titanium silicide |
Cyril Cabral, Jr., Lawrence A. Clevenger, Francois M. d'Heurle, Randy W. Mann, Glen L. Miles +3 more |
2001-02-13 |
$30,258,000 |
| 6181012 |
Copper interconnection structure incorporating a metal seed layer |
Daniel C. Edelstein, Chao-Kun Hu, Andrew H. Simon, Cyprian Emeka Uzoh |
2001-01-30 |
$13,187,000 |
| 6150723 |
Copper stud structure with refractory metal liner |
Robert M. Geffken |
2000-11-21 |
$39,339,000 |
| 6090710 |
Method of making copper alloys for chip and package interconnections |
Panayotis Andricacos, Hariklia Deligianni, Chao-Kun Hu, Dale J. Pearson, Scott K. Reynolds +2 more |
2000-07-18 |
$26,569,000 |
| 6063506 |
Copper alloys for chip and package interconnections |
Panayotis Andricacos, Hariklia Deligianni, Chao-Kun Hu, Dale J. Pearson, Scott K. Reynolds +2 more |
2000-05-16 |
$24,852,000 |
| 5911619 |
Apparatus for electrochemical mechanical planarization |
Cyprian Emeka Uzoh |
1999-06-15 |
$42,603,000 |
