Issued Patents All Time
Showing 25 most recent of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11651973 | Method and apparatus of processor wafer bonding for wafer-scale integrated supercomputer | Jae-Woong Nah, Evan G. Colgan, Robert P. Kuder, II, Bucknell C. Webb | 2023-05-16 |
| 10750615 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2020-08-18 |
| 10368441 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2019-07-30 |
| 9974179 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2018-05-15 |
| 9627784 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2017-04-18 |
| 8551816 | Direct edge connection for multi-chip integrated circuits | Steven A. Cordes, Matthew J. Farinelli, Sherif A. Goma, Peter A. Gruber, John U. Knickerbocker | 2013-10-08 |
| 8269291 | Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters | Leena Paivikki Buchwalter, Kevin K. Chan, Timothy J. Dalton, Christopher V. Jahnes, Jennifer Lund +2 more | 2012-09-18 |
| 8237271 | Direct edge connection for multi-chip integrated circuits | Steven A. Cordes, Matthew J. Farinelli, Sherif A. Goma, Peter A. Gruber, John U. Knickerbocker | 2012-08-07 |
| 7943412 | Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters | Leena Paivikki Buchwalter, Kevin K. Chan, Timothy J. Dalton, Christopher V. Jahnes, Jennifer Lund +2 more | 2011-05-17 |
| 7784673 | Rotational fill techniques for injection molding of solder | Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker | 2010-08-31 |
| 7784664 | Fill head for injection molding of solder | Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker | 2010-08-31 |
| 7694869 | Universal mold for injection molding of solder | Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker | 2010-04-13 |
| 7669748 | Conductive bonding material fill techniques | Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker | 2010-03-02 |
| 7497366 | Global vacuum injection molded solder system and method | S. Jay Chey, Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker | 2009-03-03 |
| 7468766 | Reflective spatial light modulator array including a light blocking layer | Evan G. Colgan, James M. E. Harper, Frank B. Kaufman, Margaret Paggi Manny, Robert L. Melcher | 2008-12-23 |
| 7416104 | Rotational fill techniques for injection molding of solder | Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker | 2008-08-26 |
| 7410092 | Fill head for injection molding of solder | Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker | 2008-08-12 |
| 7410090 | Conductive bonding material fill techniques | Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker | 2008-08-12 |
| 7029830 | Precision and apertures for lithographic systems | Steven A. Cordes, Michael James Cordes, Scott M. Mansfield | 2006-04-18 |
| 6893902 | Method and apparatus for thermal management of integrated circuits | Michael James Cordes, Steven A. Cordes, Uttam Shyamalindu Ghoshal, Errol Wayne Robinson | 2005-05-17 |
| 6832747 | Hybrid molds for molten solder screening process | Steven A. Cordes, David Danovitch, Peter A. Gruber, Joseph Zinter | 2004-12-21 |
| 6798953 | Guides lithographically fabricated on semiconductor devices | Mitchell S. Cohen, Michael James Cordes, Steven A. Cordes, William K. Hogan, Glen Walden Johnson +4 more | 2004-09-28 |
| 6657723 | Multimode planar spectrographs for wavelength demultiplexing and methods of fabrication | Mitchell S. Cohen, George A. Sefler | 2003-12-02 |
| 6654089 | Maskless method and system for creating a dual-domain pattern on a diamond-like carbon alignment layer | Praveen Chaudhari, James P. Doyle, Shui-Chih Lien, Minhua Lu, Robert J. von Gutfeld | 2003-11-25 |
| 6614109 | Method and apparatus for thermal management of integrated circuits | Michael James Cordes, Steven A. Cordes, Uttam Shyamalindu Ghoshal, Errol Wayne Robinson | 2003-09-02 |