Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11000474 | Microchip substance delivery devices | Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria, Lavanya Turlapati +2 more | 2021-05-11 |
| 10697927 | Reconfigurable gas sensor architecture with a high sensitivity at low temperatures | Hendrik F. Hamann, Levente Klein, Siyuan Lu, Roland Nagy | 2020-06-30 |
| 10697928 | Reconfigurable gas sensor architecture with a high sensitivity at low temperatures | Hendrik F. Hamann, Levente Klein, Siyuan Lu, Roland Nagy | 2020-06-30 |
| 10670554 | Reconfigurable gas sensor architecture with a high sensitivity at low temperatures | Hendrik F. Hamann, Levente Klein, Siyuan Lu, Roland Nagy | 2020-06-02 |
| 9937124 | Microchip substance delivery devices having low-power electromechanical release mechanisms | Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria, Lavanya Turlapati +2 more | 2018-04-10 |
| 9575040 | Methods and apparatus for detection of gaseous corrosive contaminants | Hendrik F. Hamann, Levente Klein, Michael A. Schappert, Prabjit Singh | 2017-02-21 |
| 9335346 | High performance compliant wafer test probe | Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh | 2016-05-10 |
| 9057741 | Probe-on-substrate | David M. Audette, Kevin Bocash, Steven A. Cordes, Dustin M. Fregeau | 2015-06-16 |
| 8949040 | Methods and apparatus for managing corrosion in buildings | Hendrik F. Hamann, Levente Klein, Michael A. Schappert, Andriy Stepanchuk | 2015-02-03 |
| 8933717 | Probe-on-substrate | David M. Audette, Kevin Bocash, Steven A. Cordes, Dustin M. Fregeau | 2015-01-13 |
| 8852408 | Electrochemical liquid cell apparatus | Mark den Heijer, Aparna Prabhakar, Frances M. Ross, Ranjani Sirdeshmukh | 2014-10-07 |
| 8806740 | Silicon chicklet pedestal | Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia K. Tsang | 2014-08-19 |
| 8723534 | Methods and apparatus for detection of gaseous corrosive contaminants | Hendrik F. Hamann, Levente Klein, Michael A. Schappert, Prabjit Singh | 2014-05-13 |
| 8595919 | Silicon chicklet pedestal | Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia K. Tsang | 2013-12-03 |
| 8487304 | High performance compliant wafer test probe | Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh | 2013-07-16 |
| 8241957 | Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging | Gareth G. Hougham, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul A. Lauro +2 more | 2012-08-14 |
| 8119206 | Negative coefficient of thermal expansion particles | Gareth G. Hougham, Xiao Hu Liu, Joseph Zinter, Michael J. Rooks, Brian Richard Sundolf +1 more | 2012-02-21 |
| 7987591 | Method of forming silicon chicklet pedestal | Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia K. Tsang | 2011-08-02 |
| 7883919 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging | Gareth G. Hougham, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul A. Lauro +2 more | 2011-02-08 |
| 7784669 | Method and process for reducing undercooling in a lead-free tin-rich solder alloy | Gareth G. Hougham, Kamalesh K. Srivastava, Sung Kwon Kang, Da-Yuan Shih, Brian R. Sundlof +4 more | 2010-08-31 |
| 7703661 | Method and process for reducing undercooling in a lead-free tin-rich solder alloy | Gareth G. Hougham, Kamalesh K. Srivastava, Sung Kwon Kang, Da-Yuan Shih, Brian R. Sundlof +4 more | 2010-04-27 |
| 7579069 | Negative coefficient of thermal expansion particles and method of forming the same | Gareth G. Hougham, Xiao Hu Liu, James P. Doyle, Joseph Zinter, Michael J. Rooks +2 more | 2009-08-25 |
| 7556979 | Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging | Gareth G. Hougham, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul A. Lauro +2 more | 2009-07-07 |
| 7497366 | Global vacuum injection molded solder system and method | Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker, James L. Speidell | 2009-03-03 |
| 7456640 | Structure for coupling probes of probe device to corresponding electrical contacts on product substrate | Ronald Richard Breton, Steven A. Cordes, Matthew J. Farinelli, Michael David Fregeau, Sherif A. Goma +2 more | 2008-11-25 |