| 11000474 |
Microchip substance delivery devices |
Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria, Lavanya Turlapati +2 more |
2021-05-11 |
$6,417,000 |
| 10697927 |
Reconfigurable gas sensor architecture with a high sensitivity at low temperatures |
Hendrik F. Hamann, Levente Klein, Siyuan Lu, Roland Nagy |
2020-06-30 |
$3,003,000 |
| 10697928 |
Reconfigurable gas sensor architecture with a high sensitivity at low temperatures |
Hendrik F. Hamann, Levente Klein, Siyuan Lu, Roland Nagy |
2020-06-30 |
$3,003,000 |
| 10670554 |
Reconfigurable gas sensor architecture with a high sensitivity at low temperatures |
Hendrik F. Hamann, Levente Klein, Siyuan Lu, Roland Nagy |
2020-06-02 |
$2,290,000 |
| 9937124 |
Microchip substance delivery devices having low-power electromechanical release mechanisms |
Bing Dang, John U. Knickerbocker, Kenneth F. Latzko, Joana Sofia Branquinho Teresa Maria, Lavanya Turlapati +2 more |
2018-04-10 |
$2,135,000 |
| 9575040 |
Methods and apparatus for detection of gaseous corrosive contaminants |
Hendrik F. Hamann, Levente Klein, Michael A. Schappert, Prabjit Singh |
2017-02-21 |
$8,671,000 |
| 9335346 |
High performance compliant wafer test probe |
Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh |
2016-05-10 |
$1,020,000 |
| 9057741 |
Probe-on-substrate |
David M. Audette, Kevin Bocash, Steven A. Cordes, Dustin M. Fregeau |
2015-06-16 |
$2,098,000 |
| 8949040 |
Methods and apparatus for managing corrosion in buildings |
Hendrik F. Hamann, Levente Klein, Michael A. Schappert, Andriy Stepanchuk |
2015-02-03 |
$3,062,000 |
| 8933717 |
Probe-on-substrate |
David M. Audette, Kevin Bocash, Steven A. Cordes, Dustin M. Fregeau |
2015-01-13 |
$4,389,000 |
| 8852408 |
Electrochemical liquid cell apparatus |
Mark den Heijer, Aparna Prabhakar, Frances M. Ross, Ranjani Sirdeshmukh |
2014-10-07 |
$3,450,000 |
| 8806740 |
Silicon chicklet pedestal |
Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia K. Tsang |
2014-08-19 |
$3,895,000 |
| 8723534 |
Methods and apparatus for detection of gaseous corrosive contaminants |
Hendrik F. Hamann, Levente Klein, Michael A. Schappert, Prabjit Singh |
2014-05-13 |
$6,724,000 |
| 8595919 |
Silicon chicklet pedestal |
Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia K. Tsang |
2013-12-03 |
$7,507,000 |
| 8487304 |
High performance compliant wafer test probe |
Dustin M. Fregeau, Donna S. Zupanski-Nielsen, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh |
2013-07-16 |
$5,283,000 |
| 8241957 |
Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging |
Gareth G. Hougham, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul A. Lauro +2 more |
2012-08-14 |
$4,482,000 |
| 8119206 |
Negative coefficient of thermal expansion particles |
Gareth G. Hougham, Xiao Hu Liu, Joseph Zinter, Michael J. Rooks, Brian Richard Sundolf +1 more |
2012-02-21 |
$5,017,000 |
| 7987591 |
Method of forming silicon chicklet pedestal |
Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia K. Tsang |
2011-08-02 |
$4,890,000 |
| 7883919 |
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging |
Gareth G. Hougham, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul A. Lauro +2 more |
2011-02-08 |
$4,016,000 |
| 7784669 |
Method and process for reducing undercooling in a lead-free tin-rich solder alloy |
Gareth G. Hougham, Kamalesh K. Srivastava, Sung Kwon Kang, Da-Yuan Shih, Brian R. Sundlof +4 more |
2010-08-31 |
$3,369,000 |
| 7703661 |
Method and process for reducing undercooling in a lead-free tin-rich solder alloy |
Gareth G. Hougham, Kamalesh K. Srivastava, Sung Kwon Kang, Da-Yuan Shih, Brian R. Sundlof +4 more |
2010-04-27 |
$6,715,000 |
| 7579069 |
Negative coefficient of thermal expansion particles and method of forming the same |
Gareth G. Hougham, Xiao Hu Liu, James P. Doyle, Joseph Zinter, Michael J. Rooks +2 more |
2009-08-25 |
$21,245,000 |
| 7556979 |
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging |
Gareth G. Hougham, James P. Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul A. Lauro +2 more |
2009-07-07 |
$14,962,000 |
| 7497366 |
Global vacuum injection molded solder system and method |
Steven A. Cordes, Peter A. Gruber, John U. Knickerbocker, James L. Speidell |
2009-03-03 |
$5,705,000 |
| 7456640 |
Structure for coupling probes of probe device to corresponding electrical contacts on product substrate |
Ronald Richard Breton, Steven A. Cordes, Matthew J. Farinelli, Michael David Fregeau, Sherif A. Goma +2 more |
2008-11-25 |
$6,627,000 |
