Issued Patents All Time
Showing 25 most recent of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11569181 | Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers | Sushumna Iruvanti, Shidong Li, Steve Ostrander, Jon A. Casey | 2023-01-31 |
| 11244917 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Krystyna W. Semkow, Kamalesh K. Srivastava | 2022-02-08 |
| 11171102 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Krystyna W. Semkow, Kamalesh K. Srivastava | 2021-11-09 |
| 11094657 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Krystyna W. Semkow, Kamalesh K. Srivastava | 2021-08-17 |
| 10892233 | Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers | Sushumna Iruvanti, Shidong Li, Steve Ostrander, Jon A. Casey | 2021-01-12 |
| 10622299 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Jean Audet, Brian W. Quinlan, Charles L. Reynolds | 2020-04-14 |
| 10403590 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Krystyna W. Semkow, Kamalesh K. Srivastava | 2019-09-03 |
| 10396051 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Krystyna W. Semkow, Kamalesh K. Srivastava | 2019-08-27 |
| 10224273 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Jean Audet, Brian W. Quinlan, Charles L. Reynolds | 2019-03-05 |
| 10224274 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Jean Audet, Brian W. Quinlan, Charles L. Reynolds | 2019-03-05 |
| 9947598 | Determining crackstop strength of integrated circuit assembly at the wafer level | Krishna R. Tunga, Karen P. McLaughlin, Charles L. Arvin, Steven P. Ostrander, Christopher D. Muzzy +1 more | 2018-04-17 |
| 9899313 | Multi terminal capacitor within input output path of semiconductor package interconnect | Charles L. Arvin, Jean Audet, Brian W. Quinlan, Charles L. Reynolds | 2018-02-20 |
| 9640501 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Krystyna W. Semkow, Kamalesh K. Srivastava | 2017-05-02 |
| 9472520 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Krystyna W. Semkow, Kamalesh K. Srivastava | 2016-10-18 |
| 9263363 | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive | Gareth G. Hougham, Paul A. Lauro, Jeffrey D. Gelorme | 2016-02-16 |
| 9111816 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Krystyna W. Semkow, Kamalesh K. Srivastava | 2015-08-18 |
| 9018760 | Solder interconnect with non-wettable sidewall pillars and methods of manufacture | Charles L. Arvin, Raschid J. Bezama, Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy +3 more | 2015-04-28 |
| 8910853 | Additives for grain fragmentation in Pb-free Sn-based solder | Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham +7 more | 2014-12-16 |
| 8637392 | Solder interconnect with non-wettable sidewall pillars and methods of manufacture | Charles L. Arvin, Raschid J. Bezama, Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy +3 more | 2014-01-28 |
| 8604623 | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive | Gareth G. Hougham, Paul A. Lauro, Jeffrey D. Gelorme | 2013-12-10 |
| 8493746 | Additives for grain fragmentation in Pb-free Sn-based solder | Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham +7 more | 2013-07-23 |
| 8338286 | Dimensionally decoupled ball limiting metalurgy | Eric David Perfecto, Harry D. Cox, Timothy H. Daubenspeck, David L. Questad | 2012-12-25 |
| 8293587 | Multilayer pillar for reduced stress interconnect and method of making same | Virendra R. Jadhav, Krystyna W. Semkow, Kamalesh K. Srivastava | 2012-10-23 |
| 8268282 | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive | Gareth G. Hougham, Paul A. Lauro, Jeffrey D. Gelorme | 2012-09-18 |
| 8197612 | Optimization of metallurgical properties of a solder joint | James A. Busby, Minhua Lu, Valerie Oberson, Eric D. Perfecto, Kamalesh K. Srivastava +2 more | 2012-06-12 |