Steve Ostrander — 14 Patents at IBM

Steve Ostrander has been granted 14 US patents while listed as an inventor at IBM. The first was granted in 2012 and the most recent in January 2023. Steve Ostrander ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list Steve Ostrander in Hopewell Junction, NY, US.

Patents per Year

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11569181	Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers	Sushumna Iruvanti, Shidong Li, Jon A. Casey, Brian R. Sundlof	2023-01-31	$7,725,000
11521952	Spacer for die-to-die communication in an integrated circuit and method for fabricating the same	Charles L. Arvin, Bhupender Singh, Richard F. Indyk, Thomas Weiss, Mark W. Kapfhammer	2022-12-06	$6,201,000
11404287	Fixture facilitating heat sink fabrication	Phillip Duane Isaacs, Christopher M. Marroquin, Daren Simmons, Frank L. Pompeo, Jason R. Eagle +3 more	2022-08-02	$9,617,000
11177217	Direct bonded heterogeneous integration packaging structures	Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more	2021-11-16	$1,912,000
11152226	Structure with controlled capillary coverage	Kevin Drummond, Thomas E. Lombardi, Stephanie Allard, Catherine Dufort	2021-10-19	$2,168,000
11031373	Spacer for die-to-die communication in an integrated circuit	Charles L. Arvin, Bhupender Singh, Richard F. Indyk, Thomas Weiss, Mark W. Kapfhammer	2021-06-08	$4,452,000
10985129	Mitigating cracking within integrated circuit (IC) device carrier	Thomas E. Lombardi, Krishna R. Tunga, Thomas A. Wassick	2021-04-20	$5,008,000
10978313	Fixture facilitating heat sink fabrication	Phillip Duane Isaacs, Christopher M. Marroquin, Daren Simmons, Frank L. Pompeo, Jason R. Eagle +3 more	2021-04-13	$3,936,000
10916507	Multiple chip carrier for bridge assembly	Charles L. Arvin, Brian W. Quinlan, Thomas Weiss, Mark W. Kapfhammer, Shidong Li	2021-02-09	$3,536,000
10892233	Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers	Sushumna Iruvanti, Shidong Li, Jon A. Casey, Brian R. Sundlof	2021-01-12	$3,912,000
10833051	Precision alignment of multi-chip high density interconnects	Charles L. Arvin, Thomas Weiss, Thomas A. Wassick	2020-11-10	$848,000
10580738	Direct bonded heterogeneous integration packaging structures	Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more	2020-03-03	$1,865,000
8492910	Underfill method and chip package	Michael A. Gaynes, Rajneesh Kumar, Thomas E. Lombardi	2013-07-23	$2,085,000
8129230	Underfill method and chip package	Michael A. Gaynes, Rajneesh Kumar, Thomas E. Lombardi	2012-03-06	$5,131,000

Steve Ostrander — 14 Patents

Patents per Year

Issued Patents All Time

Patent Widget