Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12353341 | Tuning of read/write cycle time delay for a memory circuit dependent on operational mode selection | Hitesh Chawla, Tanuj KUMAR, Harsh Rawat, Kedar Janardan Dhori, Promod Kumar +2 more | 2025-07-08 |
| 12170120 | Built-in self test circuit for segmented static random access memory (SRAM) array input/output | Hitesh Chawla, Tanuj KUMAR, Harsh Rawat, Kedar Janardan Dhori, Manuj AYODHYAWASI +2 more | 2024-12-17 |
| 11756930 | High bandwidth module | Charles L. Arvin, Shidong Li, Chris Muzzy, Thomas A. Wassick | 2023-09-12 |
| 11694992 | Near tier decoupling capacitors | Charles L. Arvin, Joseph C. Sorbello, Joseph Jacobi, Thomas E. Lombardi, Shidong Li +1 more | 2023-07-04 |
| 11521952 | Spacer for die-to-die communication in an integrated circuit and method for fabricating the same | Charles L. Arvin, Richard F. Indyk, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer | 2022-12-06 |
| 11410894 | Polygon integrated circuit (IC) packaging | Charles L. Arvin, Richard F. Indyk, Jon A. Casey, Shidong Li | 2022-08-09 |
| 11404365 | Direct attachment of capacitors to flip chip dies | Charles L. Arvin, Mark W. Kapfhammer, Brian W. Quinlan, Sylvain Pharand | 2022-08-02 |
| 11393759 | Alignment carrier for interconnect bridge assembly | Thomas Weiss, Charles L. Arvin, Glenn A. Pomerantz, Rachel E. Olson, Mark W. Kapfhammer | 2022-07-19 |
| 11282773 | Enlarged conductive pad structures for enhanced chip bond assembly yield | Krishna R. Tunga, Thomas Weiss, Charles L. Arvin, Brian W. Quinlan | 2022-03-22 |
| 11211262 | Electronic apparatus having inter-chip stiffener | Tuhin Sinha, Steven P. Ostrander, Sylvain Ouimet | 2021-12-28 |
| 11201136 | High bandwidth module | Charles L. Arvin, Shidong Li, Chris Muzzy, Thomas A. Wassick | 2021-12-14 |
| 11195576 | Robust adaptive method and circuit for controlling a timing window for enabling operation of sense amplifier | Shishir Kumar | 2021-12-07 |
| 11031343 | Fins for enhanced die communication | Charles L. Arvin, Richard F. Indyk, Jon A. Casey | 2021-06-08 |
| 11031373 | Spacer for die-to-die communication in an integrated circuit | Charles L. Arvin, Richard F. Indyk, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer | 2021-06-08 |
| 11004614 | Stacked capacitors for use in integrated circuit modules and the like | Charles L. Arvin, Sylvain Pharand, Brian W. Quinlan | 2021-05-11 |
| 10626074 | Process for preparation of halo substituted benzoic acid compound and intermediates thereof | Amardeep Singh, Kapil Kumar, Rajdeep Anand | 2020-04-21 |