| 12353341 |
Tuning of read/write cycle time delay for a memory circuit dependent on operational mode selection |
Hitesh Chawla, Tanuj KUMAR, Harsh Rawat, Kedar Janardan Dhori, Promod Kumar +2 more |
2025-07-08 |
|
| 12170120 |
Built-in self test circuit for segmented static random access memory (SRAM) array input/output |
Hitesh Chawla, Tanuj KUMAR, Harsh Rawat, Kedar Janardan Dhori, Manuj AYODHYAWASI +2 more |
2024-12-17 |
$45,720,000 |
| 11756930 |
High bandwidth module |
Charles L. Arvin, Shidong Li, Chris Muzzy, Thomas A. Wassick |
2023-09-12 |
$5,734,000 |
| 11694992 |
Near tier decoupling capacitors |
Charles L. Arvin, Joseph C. Sorbello, Joseph Jacobi, Thomas E. Lombardi, Shidong Li +1 more |
2023-07-04 |
|
| 11521952 |
Spacer for die-to-die communication in an integrated circuit and method for fabricating the same |
Charles L. Arvin, Richard F. Indyk, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer |
2022-12-06 |
$6,201,000 |
| 11410894 |
Polygon integrated circuit (IC) packaging |
Charles L. Arvin, Richard F. Indyk, Jon A. Casey, Shidong Li |
2022-08-09 |
$6,406,000 |
| 11404365 |
Direct attachment of capacitors to flip chip dies |
Charles L. Arvin, Mark W. Kapfhammer, Brian W. Quinlan, Sylvain Pharand |
2022-08-02 |
$9,617,000 |
| 11393759 |
Alignment carrier for interconnect bridge assembly |
Thomas Weiss, Charles L. Arvin, Glenn A. Pomerantz, Rachel E. Olson, Mark W. Kapfhammer |
2022-07-19 |
$13,174,000 |
| 11282773 |
Enlarged conductive pad structures for enhanced chip bond assembly yield |
Krishna R. Tunga, Thomas Weiss, Charles L. Arvin, Brian W. Quinlan |
2022-03-22 |
$5,808,000 |
| 11211262 |
Electronic apparatus having inter-chip stiffener |
Tuhin Sinha, Steven P. Ostrander, Sylvain Ouimet |
2021-12-28 |
$7,175,000 |
| 11201136 |
High bandwidth module |
Charles L. Arvin, Shidong Li, Chris Muzzy, Thomas A. Wassick |
2021-12-14 |
$4,192,000 |
| 11195576 |
Robust adaptive method and circuit for controlling a timing window for enabling operation of sense amplifier |
Shishir Kumar |
2021-12-07 |
$38,706,000 |
| 11031343 |
Fins for enhanced die communication |
Charles L. Arvin, Richard F. Indyk, Jon A. Casey |
2021-06-08 |
$4,452,000 |
| 11031373 |
Spacer for die-to-die communication in an integrated circuit |
Charles L. Arvin, Richard F. Indyk, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer |
2021-06-08 |
$4,452,000 |
| 11004614 |
Stacked capacitors for use in integrated circuit modules and the like |
Charles L. Arvin, Sylvain Pharand, Brian W. Quinlan |
2021-05-11 |
$6,417,000 |
| 10626074 |
Process for preparation of halo substituted benzoic acid compound and intermediates thereof |
Amardeep Singh, Kapil Kumar, Rajdeep Anand |
2020-04-21 |
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