Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177217 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more | 2021-11-16 |
| 10699972 | Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity | William E. Bernier, Timothy H. Daubenspeck, Virendra R. Jadhav, David L. Questad | 2020-06-30 |
| 10580738 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more | 2020-03-03 |
| 9899279 | Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity | William E. Bernier, Timothy H. Daubenspeck, Virendra R. Jadhav, David L. Questad | 2018-02-20 |
| 9815149 | Flux composition and techniques for use thereof | Kang-Wook Lee, Nathalie Normand | 2017-11-14 |
| 9808874 | Flux composition and techniques for use thereof | Kang-Wook Lee, Jae-Woong Nah, Nathalie Normand | 2017-11-07 |
| 9579738 | Flux composition and techniques for use thereof | Kang-Wook Lee, Jae-Woong Nah, Nathalie Normand | 2017-02-28 |
| 8957531 | Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity | William E. Bernier, Timothy H. Daubenspeck, Virendra R. Jadhav, David L. Questad | 2015-02-17 |
| 8444774 | Flux composition and process for use thereof | Eric Duschesne, Kang-Wook Lee | 2013-05-21 |
| 8314500 | Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith +8 more | 2012-11-20 |
| 8268716 | Creation of lead-free solder joint with intermetallics | Charles L. Arvin, Srinivasa N. Reddy, Krystyna W. Semkow, Richard A. Shelleman, Kamalesh K. Srivistava | 2012-09-18 |
| 8197612 | Optimization of metallurgical properties of a solder joint | James A. Busby, Minhua Lu, Eric D. Perfecto, Kamalesh K. Srivastava, Brian R. Sundlof +2 more | 2012-06-12 |
| 8003512 | Structure of UBM and solder bumps and methods of fabrication | Luc Belanger, Marc A. Bergendahl, Ajay P. Giri, Paul A. Lauro, Da-Yuan Shih | 2011-08-23 |
| 7932169 | Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith +8 more | 2011-04-26 |
| 7780801 | Flux composition and process for use thereof | Eric Duchesne, Kang-Wook Lee | 2010-08-24 |
| 7740713 | Flux composition and techniques for use thereof | Eric Duchesne, Michael A. Gaynes, Timothy A. Gosselin, Kang-Wook Lee | 2010-06-22 |
| 7332424 | Fluxless solder transfer and reflow process | Luc Belanger, Peter A. Gruber, Christopher L. Tessler | 2008-02-19 |