Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging

Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging

US Patent 8241957 · Granted Aug 14, 2012

Estimated economic value: $4,482,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ultrasonic-assisted solder transfer2023
Forming ultra-thin chips for flexible electronics applications2022
Combination polyimide decal with a rigid mold2022
Enhancement of iso-via reliability2022
Low-profile battery construct with engineered interfaces2021
Micro-electro-mechanical system (MEMS) structures and design structures2021
Multi-chip package structure having high density chip interconnect bridge with e2021
Continuous solder transfer to substrates2021
Use of a reactive, or reducing gas as a method to increase contact lifetime in m2021
Planar cavity MEMS and related structures, methods of manufacture and design str2021
Planar cavity MEMS and related structures, methods of manufacture and design str2021
Flexible electronics for wearable healthcare sensors2021