Issued Patents All Time
Showing 1–25 of 174 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12099899 | Increasing grain size of polycrystalline superconducting materials for superconducting circuits | Benjamin Wymore, Markus Brink, Sweet Jean L. | 2024-09-24 |
| 12102016 | Amorphous superconducting alloys for superconducting circuits | Benjamin Wymore, Markus Brink, Stephen L. Brown | 2024-09-24 |
| 12040373 | Liner-free resistance contacts and silicide with silicide stop layer | Nicolas Loubet, Adra Carr, Nicholas Anthony Lanzillo | 2024-07-16 |
| 11552237 | Grain size control of superconducting materials in thin films for Josephson junctions | Benjamin Wymore, Markus Brink, John Bruley | 2023-01-10 |
| 11495724 | Superconducting structure and device surface termination with alloy | Benjamin Wymore, Markus Brink | 2022-11-08 |
| 11480537 | Methods and structure to probe the metal-metal interface for superconducting circuits | Markus Brink, Benjamin Wymore, Jeng-Bang Yau | 2022-10-25 |
| 11088033 | Low resistance source-drain contacts using high temperature silicides | Praneet Adusumilli, Hemanth Jagannathan, Ahmet S. Ozcan | 2021-08-10 |
| 11062956 | Low resistance source-drain contacts using high temperature silicides | Praneet Adusumilli, Hemanth Jagannathan, Ahmet S. Ozcan | 2021-07-13 |
| 10978342 | Interconnect with self-forming wrap-all-around barrier layer | Huai Huang, Takeshi Nogami, Alfred Grill, Benjamin D. Briggs, Nicholas Anthony Lanzillo +3 more | 2021-04-13 |
| 10943988 | Thermally stable salicide formation for salicide first contacts | Praneet Adusumilli, Emre Alptekin, Ahmet S. Ozcan | 2021-03-09 |
| 10943863 | Techniques to improve reliability in Cu interconnects using Cu intermetallics | Chao-Kun Hu, Stephen M. Rossnagel, Thomas M. Shaw | 2021-03-09 |
| 10937889 | Forming thermally stable salicide for salicide first contacts | Praneet Adusumilli, Emre Alptekin, Ahmet S. Ozcan | 2021-03-02 |
| 10840174 | Metallic synapses for neuromorphic and evolvable hardware | Shawn P. Fetterolf, Jin-Ping Han, Paul S. McLaughlin, Ahmet S. Ozcan, Roger QUON | 2020-11-17 |
| 10825740 | Low resistance source-drain contacts using high temperature silicides | Praneet Adusumilli, Hemanth Jagannathan, Ahmet S. Ozcan | 2020-11-03 |
| 10818590 | Techniques to improve reliability in Cu interconnects using Cu intermetallics | Chao-Kun Hu, Stephen M. Rossnagel, Thomas M. Shaw | 2020-10-27 |
| 10777645 | P-N junction based devices with single species impurity for P-type and N-type doping | Guy M. Cohen, Paul M. Solomon | 2020-09-15 |
| 10707167 | Contacts to semiconductor substrate and methods of forming same | Emre Alptekin, Nicolas L. Breil, Ahmet S. Ozcan, Kathryn T. Schonenberg | 2020-07-07 |
| 10707148 | Elbow contact for field-effect transistor and manufacture thereof | Guy M. Cohen, Ahmet S. Ozcan, Paul M. Solomon | 2020-07-07 |
| 10685888 | Low resistance source-drain contacts using high temperature silicides | Praneet Adusumilli, Hemanth Jagannathan, Ahmet S. Ozcan | 2020-06-16 |
| 10615261 | P-N junction based devices with single species impurity for P-type and N-type doping | Guy M. Cohen, Paul M. Solomon | 2020-04-07 |
| 10546941 | Forming thermally stable salicide for salicide first contacts | Praneet Adusumilli, Emre Alptekin, Ahmet S. Ozcan | 2020-01-28 |
| 10541191 | Elbow contact for field-effect transistor and manufacture thereof | Guy M. Cohen, Ahmet S. Ozcan, Paul M. Solomon | 2020-01-21 |
| 10461026 | Techniques to improve reliability in Cu interconnects using Cu intermetallics | Chao-Kun Hu, Stephen M. Rossnagel, Thomas M. Shaw | 2019-10-29 |
| 10453935 | Thermally stable salicide formation for salicide first contacts | Praneet Adusumilli, Emre Alptekin, Ahmet S. Ozcan | 2019-10-22 |
| 10411101 | P-N junction based devices with single species impurity for P-type and N-type doping | Guy M. Cohen, Paul M. Solomon | 2019-09-10 |