JN

Jawahar P. Nayak

IBM: 15 patents #7,450 of 70,183Top 15%
Globalfoundries: 1 patents #2,221 of 4,424Top 55%
📍 Wappingers Falls, NY: #123 of 884 inventorsTop 15%
🗺 New York: #9,079 of 115,490 inventorsTop 8%
Overall (All Time): #295,343 of 4,157,543Top 8%
16
Patents All Time

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDate
10714411 Interconnected integrated circuit (IC) chip structure and packaging and method of forming same Wolfgang Sauter, Mark W. Kuemerle, Eric W. Tremble, David B. Stone, Nicholas A. Polomoff +2 more 2020-07-14
7962865 System and method for employing patterning process statistics for ground rules waivers and optimization Fook-Luen Heng, Mark A. Lavin, Jin-Fuw Lee, Chieh-Yu Lin, Rama N. Singh 2011-06-14
7456098 Building metal pillars in a chip for structure support Habib Hichri, Xiao Hu Liu, Vincent J. McGahay, Conal E. Murray, Thomas M. Shaw 2008-11-25
7448018 System and method for employing patterning process statistics for ground rules waivers and optimization Fook-Luen Heng, Mark A. Lavin, Jin-Fuw Lee, Chieh-Yu Lin, Rama N. Singh 2008-11-04
7138714 Via barrier layers continuous with metal line barrier layers at notched or dielectric mesa portions in metal lines Du Nguyen, Birendra Agarwala, Conrad A. Barile, Hazara S. Rathore 2006-11-21
7067902 Building metal pillars in a chip for structure support Habib Hichri, Xiao Hu Liu, Vincent J. McGahay, Conal E. Murray, Thomas M. Shaw 2006-06-27
6972209 Stacked via-stud with improved reliability in copper metallurgy Birendra Agarwala, Conrad A. Barile, Hormazdyar M. Dalal, Brett H. Engle, Michael Lane +8 more 2005-12-06
6750109 Halo-free non-rectifying contact on chip with halo source/drain diffusion James A. Culp, Werner Rausch, Melanie J. Sherony, Steven H. Voldman, Noah Zamdmer 2004-06-15
6475555 Process for screening features on an electronic substrate with a low viscosity paste Jon A. Casey, Dinesh Gupta, Lester W. Herron, John U. Knickerbocker, David C. Long +2 more 2002-11-05
6429482 Halo-free non-rectifying contact on chip with halo source/drain diffusion James A. Culp, Werner Rausch, Melanie J. Sherony, Steven H. Voldman, Noah Zamdmer 2002-08-06
6341417 Pre-patterned substrate layers for being personalized as needed Dinesh Gupta, Lester W. Herron, John U. Knickerbocker, David C. Long, Keith C. O'Neil +1 more 2002-01-29
6238741 Single mask screening process James M. Blazick, Michael E. Cropp, James N. Humenik, Gerald H. Leino, Frank V. Ranalli +5 more 2001-05-29
6231707 Method of forming a multilayer ceramic substrate with max-punched vias Dinesh Gupta, L. Wynn Herron, John U. Knickerbocker, David C. Long, Robert A. Rita 2001-05-15
6221193 Defect reduction method for screened greensheets and article produced therefrom Richard J. Cassidy, John R. Lankard, Jr. 2001-04-24
5951917 Conductive paste for large greensheet screening including high thixotropic agent content Michael E. Cropp, John M. Wargo, Nancy A. Wier-Cavalieri, Charles W. Hunter, Jr. 1999-09-14
5783113 Conductive paste for large greensheet screening including high thixotropic agent content Michael E. Cropp, John M. Wargo, Nancy A. Wier-Cavalieri, Charles W. Hunter, Jr. 1998-07-21