Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12095494 | Lateral escape using triangular structure of transceivers | Aatreya Chakravarti, Wolfgang Sauter, Mark W. Kuemerle | 2024-09-17 |
| 11282806 | Partitioned substrates with interconnect bridge | Wolfgang Sauter, Mark W. Kuemerle | 2022-03-22 |
| 10714411 | Interconnected integrated circuit (IC) chip structure and packaging and method of forming same | Wolfgang Sauter, Mark W. Kuemerle, David B. Stone, Nicholas A. Polomoff, Eric S. Parent +2 more | 2020-07-14 |
| 10483233 | Split ball grid array pad for multi-chip modules | Anson J. Call, Erwin B. Cohen, Dany Minier, Wolfgang Sauter, David B. Stone | 2019-11-19 |
| 9875956 | Integrated interface structure | Wolfgang Sauter, Mark W. Kuemerle, Daniel P. Greenberg | 2018-01-23 |
| 9633914 | Split ball grid array pad for multi-chip modules | Anson J. Call, Erwin B. Cohen, Dany Minier, Wolfgang Sauter, David B. Stone | 2017-04-25 |
| 8438520 | Early decoupling capacitor optimization method for hierarchical circuit design | Kurt A. Carlsen, Charles S. Chiu, Umberto Garofano, Ze Gui Pang, David L. Toub +1 more | 2013-05-07 |
| 8429590 | System-level method for reducing power supply noise in an electronic system | Timothy W. Budell | 2013-04-23 |
| 8312404 | Multi-segments modeling bond wire interconnects with 2D simulations in high speed, high density wire bond packages | Haitian Hu, Timothy W. Budell, Charles S. Chiu | 2012-11-13 |
| 7882469 | Automatic verification of adequate conductive return-current paths | Timothy W. Budell, David C. Reynolds | 2011-02-01 |
| 6945791 | Integrated circuit redistribution package | Timothy W. Budell, Brian Welch | 2005-09-20 |