| 12095494 |
Lateral escape using triangular structure of transceivers |
Aatreya Chakravarti, Wolfgang Sauter, Mark W. Kuemerle |
2024-09-17 |
| 11282806 |
Partitioned substrates with interconnect bridge |
Wolfgang Sauter, Mark W. Kuemerle |
2022-03-22 |
| 10714411 |
Interconnected integrated circuit (IC) chip structure and packaging and method of forming same |
Wolfgang Sauter, Mark W. Kuemerle, David B. Stone, Nicholas A. Polomoff, Eric S. Parent +2 more |
2020-07-14 |
| 10483233 |
Split ball grid array pad for multi-chip modules |
Anson J. Call, Erwin B. Cohen, Dany Minier, Wolfgang Sauter, David B. Stone |
2019-11-19 |
| 9875956 |
Integrated interface structure |
Wolfgang Sauter, Mark W. Kuemerle, Daniel P. Greenberg |
2018-01-23 |
| 9633914 |
Split ball grid array pad for multi-chip modules |
Anson J. Call, Erwin B. Cohen, Dany Minier, Wolfgang Sauter, David B. Stone |
2017-04-25 |
| 8438520 |
Early decoupling capacitor optimization method for hierarchical circuit design |
Kurt A. Carlsen, Charles S. Chiu, Umberto Garofano, Ze Gui Pang, David L. Toub +1 more |
2013-05-07 |
| 8429590 |
System-level method for reducing power supply noise in an electronic system |
Timothy W. Budell |
2013-04-23 |
| 8312404 |
Multi-segments modeling bond wire interconnects with 2D simulations in high speed, high density wire bond packages |
Haitian Hu, Timothy W. Budell, Charles S. Chiu |
2012-11-13 |
| 7882469 |
Automatic verification of adequate conductive return-current paths |
Timothy W. Budell, David C. Reynolds |
2011-02-01 |
| 6945791 |
Integrated circuit redistribution package |
Timothy W. Budell, Brian Welch |
2005-09-20 |
