Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10714411 | Interconnected integrated circuit (IC) chip structure and packaging and method of forming same | Wolfgang Sauter, Mark W. Kuemerle, Eric W. Tremble, David B. Stone, Nicholas A. Polomoff +2 more | 2020-07-14 |
| 10402524 | Prediction of process-sensitive geometries with machine learning | Liang Cao, Jie Zhang, David N. Power | 2019-09-03 |