Issued Patents All Time
Showing 25 most recent of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7255153 | High performance integrated MLC cooling device for high power density ICS and method for manufacturing | Daniel G. Berger, Raschid J. Bezama, Bruno Michel, Govindarajan Natarajan | 2007-08-14 |
| 6762119 | Method of preventing solder wetting in an optical device using diffusion of Cr | Sudipta K. Ray, Mitchell S. Cohen, Mario J. Interrante, Thomas E. Lombardi, Subhash L. Shinde | 2004-07-13 |
| 6528145 | Polymer and ceramic composite electronic substrates | Daniel G. Berger, Shaji Farooq, James N. Humenik, John U. Knickerbocker, Robert W. Pasco +2 more | 2003-03-04 |
| 6475555 | Process for screening features on an electronic substrate with a low viscosity paste | Jon A. Casey, Dinesh Gupta, John U. Knickerbocker, David C. Long, Jawahar P. Nayak +2 more | 2002-11-05 |
| 6373133 | Multi-chip module and heat-sink cap combination | Giulio DiGiacomo, Stephen S. Drofitz, Jr., David L. Edwards, Larry D. Gross, Sushumna Iruvanti +4 more | 2002-04-16 |
| 6358439 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Hal Mitchell Lasky +6 more | 2002-03-19 |
| 6341417 | Pre-patterned substrate layers for being personalized as needed | Dinesh Gupta, John U. Knickerbocker, David C. Long, Jawahar P. Nayak, Keith C. O'Neil +1 more | 2002-01-29 |
| 6306528 | Method for the controlling of certain second phases in aluminum nitride | Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon +4 more | 2001-10-23 |
| 6272957 | Flex die punching apparatus and method | William Dale Carbaugh, Jr., Mark W. Kapfhammer, Mark J. LaPlante, David C. Long, Nabil Amir Rizk +1 more | 2001-08-14 |
| 6200373 | Method for controlling of certain second phases in aluminum nitride | Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon +4 more | 2001-03-13 |
| 6124041 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Hal Mitchell Lasky +6 more | 2000-09-26 |
| 6116127 | Flex die punching apparatus and method | William Dale Carbaugh, Jr., Mark W. Kapfhammer, Mark J. LaPlante, David C. Long, Nabil Amir Rizk +1 more | 2000-09-12 |
| 6037193 | Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity | Mario J. Interrante, Laertis Economikos | 2000-03-14 |
| 6004624 | Method for the controlling of certain second phases in aluminum nitride | Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon +4 more | 1999-12-21 |
| 5981310 | Multi-chip heat-sink cap assembly | Giulio DiGiacomo, Stephen S. Drofitz, Jr., David L. Edwards, Larry D. Gross, Sushumna Iruvanti +4 more | 1999-11-09 |
| 5974931 | Flex die punching apparatus and method | William Dale Carbaugh, Jr., Mark W. Kapfhammer, Mark J. LaPlante, David C. Long, Nabil Amir Rizk +1 more | 1999-11-02 |
| 5945735 | Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity | Laertis Economikos, Mario J. Interrante | 1999-08-31 |
| 5932043 | Method for flat firing aluminum nitride/tungsten electronic modules | Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon +4 more | 1999-08-03 |
| 5925443 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Hal Mitchell Lasky +6 more | 1999-07-20 |
| 5888446 | Method of forming an aluminum nitride article utilizing a platinum catalyst | Jon A. Casey, Jonathan H. Harris, Irvin C. Huseby, Richard A. Shelleman, Subhash L. Shinde +1 more | 1999-03-30 |
| 5773377 | Low temperature sintered, resistive aluminum nitride ceramics | Jonathan H. Harris, Robert A. Youngman, Subhash L. Shinde, Benjamin V. Fasano | 1998-06-30 |
| 5763093 | Aluminum nitride body having graded metallurgy | Jon A. Casey, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon +7 more | 1998-06-09 |
| 5682589 | Aluminum nitride body having graded metallurgy | Jon A. Casey, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon +7 more | 1997-10-28 |
| 5552107 | Aluminum nitride body having graded metallurgy | Jon A. Casey, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon +7 more | 1996-09-03 |
| 5552232 | Aluminum nitride body having graded metallurgy | Jon A. Casey, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon +7 more | 1996-09-03 |