Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6358439 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more | 2002-03-19 | $20,987,000 |
| 6124041 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more | 2000-09-26 | $64,342,000 |
| 5925443 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more | 1999-07-20 | $27,822,000 |