Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias

Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias

US Patent 6124041 · Granted Sep 26, 2000

Estimated economic value: $64,342,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Compositions and methods for measuring bacterial growth2025
Methods for etching glass-based substrates2024
Compositions and methods for measuring bacterial growth2022
Strengthened thin glass-polymer laminates2021
Methods for printing on glass2021
Liquid cooled compliant heat sink and related method2019
Methods for printing ink on pre-treated glass substrates2019
Liquid cooled compliant heat sink and related method2019
Strengthened laminated glass structures2018
Methods of forming laminated glass structures2018
Methods of processing a glass substrate and glass apparatus2018
Methods for printing on glass2017