| 6358439 |
Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias |
Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more |
2002-03-19 |
| 6124041 |
Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias |
Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more |
2000-09-26 |
| 5925443 |
Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias |
Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more |
1999-07-20 |
| 5541005 |
Large ceramic article and method of manufacturing |
Raschid J. Bezama, Jon A. Casey, Mario E. Ecker, Shaji Farooq, Irene S. Frantz +12 more |
1996-07-30 |
| 5532031 |
I/O pad adhesion layer for a ceramic substrate |
Shaji Farooq, Sampath Purushothaman, Srinivasa S. N. Reddy |
1996-07-02 |
| 5483105 |
Module input-output pad having stepped set-back |
Suryanarayana Kaja, Eric D. Perfecto, William H. Price, Sampath Purushothaman, Srinivasa N. Reddy +1 more |
1996-01-09 |
| 5439636 |
Large ceramic articles and method of manufacturing |
Raschid J. Bezama, Jon A. Casey, Mario E. Ecker, Shaji Farooq, Irene S. Frantz +12 more |
1995-08-08 |
| 5304517 |
Toughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sintering |
Jon A. Casey, Sylvia Marie DeCarr, Srinivasa S. N. Reddy, Subhash L. Shinde, Rao R. Tummala |
1994-04-19 |
