Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6358439 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron, Hal Mitchell Lasky +6 more | 2002-03-19 |
| 6124041 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron, Hal Mitchell Lasky +6 more | 2000-09-26 |
| 5925443 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron, Hal Mitchell Lasky +6 more | 1999-07-20 |
| 5337475 | Process for producing ceramic circuit structures having conductive vias | Emanuel I. Cooper, Peter Richard Duncombe, Shaji Farooq, Edward A. Giess, Young-Ho Kim +12 more | 1994-08-16 |
| 5283104 | Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates | Emanuel I. Cooper, Peter Richard Duncombe, Shaji Farooq, Edward A. Giess, Young-Ho Kim +12 more | 1994-02-01 |