Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315787 | Embedded semiconductor packages and methods thereof | Nobuo Ogura, Siddharth Ravichandran, Venkatesh Sundaram | 2025-05-27 |
| 12027453 | Embedded semiconductor packages and methods thereof | Nobuo Ogura, Siddharth Ravichandran, Venkatesh Sundaram | 2024-07-02 |
| 11756985 | Substrate-compatible inductors with magnetic layers | Markondeya Raj Pulugurtha, Yoshihiro FURUKAWA, Himani Sharma, Keiji Takemura, Teng Sun | 2023-09-12 |
| 10672718 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Venkatesh Sundaram, Fuhan Liu, Vijay Sukumaran, Vivek Swaminathan Sridharan, Qiao Chen | 2020-06-02 |
| 9417415 | Interposer with polymer-filled or polymer-lined optical through-vias in thin glass substrate | Chia-Te Chou, Venkatesh Sundaram | 2016-08-16 |
| 9275934 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Venkatesh Sundaram, Fuhan Liu, Vijay Sukumaran, Vivek Swaminathan Sridharan, Qiao Chen | 2016-03-01 |
| 9173282 | Interconnect structures and methods of making the same | Pulugurtha Markondeya Raj, Nitesh Kumbhat, Venkatesh Sundaram | 2015-10-27 |
| 9167694 | Ultra-thin interposer assemblies with through vias | Venkatesh Sundaram | 2015-10-20 |
| 8970036 | Stress relieving second level interconnect structures and methods of making the same | Pulugurtha Markondeya Raj, Nitesh Kumbhat, Venkatesh Sundaram, Xian Qin | 2015-03-03 |
| 8633601 | Interconnect assemblies and methods of making and using same | Nitesh Kumbhat, Abhishek Choudhury, Venkatesh Sundaram | 2014-01-21 |
| 8536695 | Chip-last embedded interconnect structures | Fuhan Liu, Nitesh Kumbhat, Venkatesh Sundaram | 2013-09-17 |
| 8335084 | Embedded actives and discrete passives in a cavity within build-up layers | Baik Woo Lee, Chong Kwang Yoon, Verkatesh Sundaram | 2012-12-18 |
| 8174017 | Integrating three-dimensional high capacitance density structures | Markondeya Raj Pulugurtha, Devarajan Balaraman, Isaac Abothu, Farrokh Ayazi | 2012-05-08 |
| 8084841 | Systems and methods for providing high-density capacitors | Markondeyaraj Pulugurtha, Andreas Fenner, Anna J. Malin, Dasharatham Janagama Goud | 2011-12-27 |
| 7977758 | Ferroelectrics and ferromagnetics for noise isolation in integrated circuits, packaging, and system architectures | Markondeya Raj Pulugurtha, Madhaven Swaminathan, Mahadevan Iyer, Isaac Abothu, Jin Hyun Hwang | 2011-07-12 |
| 7556189 | Lead-free bonding systems | Ankur Aggarwal, Isaac Abothu, Pulugurtha Markondeya Raj | 2009-07-07 |
| 7557448 | High-aspect-ratio metal-polymer composite structures for nano interconnects | Ankur Aggarwal, Pulugurtha Markondeya Raj | 2009-07-07 |
| 7262075 | High-aspect-ratio metal-polymer composite structures for nano interconnects | Ankur Aggarwal, Pulugurtha Markondeya Raj | 2007-08-28 |
| 6261941 | Method for manufacturing a multilayer wiring substrate | Weipang Li | 2001-07-17 |
| 5304517 | Toughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sintering | Jon A. Casey, Sylvia Marie DeCarr, Srinivasa S. N. Reddy, Subhash L. Shinde, Vivek M. Sura | 1994-04-19 |
| 5196251 | Ceramic substrate having a protective coating thereon and a method for protecting a ceramic substrate | Nanik Bakhru, Richard A. Bates, George Czornyj, Nunzio DiPaolo, Ananda H. Kumar +2 more | 1993-03-23 |
| 4504340 | Material and process set for fabrication of molecular matrix print head | Raj N. Master | 1985-03-12 |
| 4413061 | Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper | Ananda H. Kumar, Peter W. McMillan | 1983-11-01 |
| 4301324 | Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper | Ananda H. Kumar, Peter W. McMillan | 1981-11-17 |
| 4234367 | Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors | Lester W. Herron, Raj N. Master | 1980-11-18 |