Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10204876 | Pad defined contact for wafer level package | Tiao Zhou, Ricky Agrawal | 2019-02-12 |
| 8633601 | Interconnect assemblies and methods of making and using same | Nitesh Kumbhat, Venkatesh Sundaram, Rao R. Tummala | 2014-01-21 |