Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12370576 | Chip-on-array with interposer for a multidimensional transducer array | Stephen R. Barnes | 2025-07-29 |
| 11965961 | Direct chip-on-array for a multidimensional transducer array | — | 2024-04-23 |
| 11656355 | Direct chip-on-array for a multidimensional transducer array | — | 2023-05-23 |
| 11498096 | Chip-on-array with interposer for a multidimensional transducer array | Stephen R. Barnes | 2022-11-15 |
| 11101424 | Ultrasound transducer and manufacturing method thereof | Kyungho Lee, YoungShin Kim | 2021-08-24 |
| 10923650 | Magneto-resistive chip package including shielding structure | Jae Gwon Jang, Young Jae Kim | 2021-02-16 |
| 10074799 | Magneto-resistive chip package including shielding structure | Jae Gwon Jang, Young Jae Kim | 2018-09-11 |
| 9893020 | Semiconductor device | Eun-Seok Song, Young Jae Kim, Jae Gwon Jang | 2018-02-13 |
| 9775230 | Printed circuit board and semiconductor packages including the same | Young Jae Kim, Hyung-Gil Baek | 2017-09-26 |
| 9627327 | Semiconductor package and method of manufacturing the same | Dong Hun Lee, Jae Gwon Jang, Chul-Yong Jang | 2017-04-18 |
| 9520377 | Semiconductor device package including bonding layer having Ag3Sn | Jeong-Won Yoon, Seong-woon Booh, Chang Mo JEONG | 2016-12-13 |
| 9431374 | Semiconductor package | Seok Hyun LEE | 2016-08-30 |
| 9087833 | Power semiconductor devices | Seong-woon Booh | 2015-07-21 |
| 9082693 | Nitride semiconductor based power converting device | Woo Chul Jeon, Jai-kwang Shin, Jae-joon Oh | 2015-07-14 |
| 8963325 | Power device and power device module | Young-Hun Byun, Seong-woon Booh, Chang Mo JEONG | 2015-02-24 |
| 8872041 | Multilayer laminate package and method of manufacturing the same | Ji-hyuk Lim, Seong-woon Booh | 2014-10-28 |
| 8861205 | Folded stacked package and method of manufacturing the same | — | 2014-10-14 |
| 8335084 | Embedded actives and discrete passives in a cavity within build-up layers | Chong Kwang Yoon, Verkatesh Sundaram, Rao R. Tummala | 2012-12-18 |