Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11244938 | Electronic device package | JU-YOUN CHOI, Seung-Yong Cha, Yun-Hee Lee | 2022-02-08 |
| 10864288 | Disinfecting and sterilizing device for medical sensor | Ju Young Lee | 2020-12-15 |
| 10665575 | Semiconductor package | Chan-kyung Kim, Tae-Joo Hwang | 2020-05-26 |
| 10490509 | Substrate having power delivery network for reducing electromagnetic interference and devices including the substrate | Sung Wook Moon, Min Sung Kim, Kyoung Ho Kim, Dong Chul Kim, Jin Ho Kim +1 more | 2019-11-26 |
| 10475774 | Semiconductor package | Chan-kyung Kim, Tae-Joo Hwang | 2019-11-12 |
| 10424571 | Electronic device package | JU-YOUN CHOI, Seung-Yong Cha, Yun-Hee Lee | 2019-09-24 |
| 10262967 | Semiconductor packages | Tae-Joo Hwang | 2019-04-16 |
| 9893020 | Semiconductor device | Baik Woo Lee, Young Jae Kim, Jae Gwon Jang | 2018-02-13 |
| 9746704 | Support structure and liquid crystal display device including the same | — | 2017-08-29 |
| 8647976 | Semiconductor package having test pads on top and bottom substrate surfaces and method of testing same | Dong-Han Kim, Hee-Seok Lee | 2014-02-11 |
| 8552521 | Semiconductor package to remove power noise using ground impedance | Hee-Seok Lee, Sung-Woo Park | 2013-10-08 |
| 8502084 | Semiconductor package including power ball matrix and power ring having improved power integrity | Hee-Seok Lee, Hyun Ah Kim, So-Young Lim | 2013-08-06 |
| 8143713 | Chip-on-board package | YoungHoon Ro | 2012-03-27 |
| 8120024 | Semiconductor package having test pads on top and bottom substrate surfaces and method of testing same | Dong-Han Kim, Hee-Seok Lee | 2012-02-21 |
| 8084359 | Semiconductor package and methods of manufacturing the same | Se-Ho You, Ki-Won Choi | 2011-12-27 |
| 8085545 | Structure for blocking an electromagnetic interference, wafer level package and printed circuit board having the same | — | 2011-12-27 |
| 7936232 | Substrate for semiconductor package | Hee-Seok Lee, So-Young Lim | 2011-05-03 |
| 7880286 | Tape wiring substrate and chip-on-film package using the same | Si-Hoon Lee | 2011-02-01 |
| 7760044 | Substrate for semiconductor package | Hee-Seok Lee, So-Young Lim | 2010-07-20 |
| 7705433 | Semiconductor package preventing generation of static electricity therein | Hee-Seok Lee, Yun-Seok Choi | 2010-04-27 |
| 7508680 | Adjustable-inductance filter, tape distribution substrate comprising the filter, and display panel assembly comprising the tape distribution substrate | Hee-Seok Lee, Yun-Seok Choi, Young-Sang Cho, Na-Rae Shin | 2009-03-24 |
| 7495317 | Semiconductor package with ferrite shielding structure | Un-Byoung Kang, Si-Hoon Lee | 2009-02-24 |
| 7489035 | Integrated circuit chip package having a ring-shaped silicon decoupling capacitor | Hee-Seok Lee | 2009-02-10 |
| 7420270 | Tape wiring substrate and chip-on-film package using the same | Si-Hoon Lee | 2008-09-02 |
| 7337079 | Time-frequency domain reflectometry apparatus and method | Jin-Bae Park, Yong-June Shin, Jong Gwan Yook, Edward J. Powers, Joo Won Kim +2 more | 2008-02-26 |