| 11586079 |
Film type package comprising a plurality of test lines and a plurality of first and second connection pads and display apparatus having the same |
Byung-Hun Han, Jung Eun Koo |
2023-02-21 |
| 11231626 |
Film type package comprising a plurality of test pads disposed on a plurality of margin areas and separated from a plurality of first connection pads by a cut line |
Byung-Hun Han, Jung Eun Koo |
2022-01-25 |
| 10903127 |
Film for a package substrate |
Ye-Chung Chung |
2021-01-26 |
| 10699974 |
Film for package substrate, semiconductor package, display device, and methods of fabricating the film, the semiconductor package, the display device |
Ye-Chung Chung |
2020-06-30 |
| 9869717 |
Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring substrate for a tape packaging having the same |
Sang-Heui Lee |
2018-01-16 |
| 9437526 |
Chip on film package including distributed via plugs |
Na-Rae Shin, Jeong-Kyu Ha, Kyoung-Suk Yang, Pa-Lan Lee |
2016-09-06 |
| 9280182 |
Chip on film package and display device including the same |
Jeong-Kyu Ha, Kwan-Jai Lee, Jae-Min Jung, Kyong-Soon Cho, Na-Rae Shin +2 more |
2016-03-08 |
| 9059067 |
Semiconductor device with interposer and method manufacturing same |
Yun-Seok Choi, In Won O |
2015-06-16 |
| 9059162 |
Chip on film (COF) substrate, COF package and display device including the same |
Jeong-Kyu Ha, Kwan-Jai Lee, Jae-Min Jung, Kyong-Soon Cho, Na-Rae Shin +2 more |
2015-06-16 |
| 8581373 |
Tape package |
Dong-Han Kim |
2013-11-12 |
| 8502084 |
Semiconductor package including power ball matrix and power ring having improved power integrity |
Eun-Seok Song, Hee-Seok Lee, Hyun Ah Kim |
2013-08-06 |
| 8436462 |
Semiconductor housing package, semiconductor package structure including the semiconductor housing package, and processor-based system including the semiconductor package structure |
Dong-Han Kim, Sung-Woo Park, Jin-Woo Park, Jung-Hwan Kim, Kwang-Jin Bae +1 more |
2013-05-07 |
| 8384407 |
Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring subtrate for a tape package having the same |
Sang-Heul Lee |
2013-02-26 |
| 7936232 |
Substrate for semiconductor package |
Eun-Seok Song, Hee-Seok Lee |
2011-05-03 |
| 7760044 |
Substrate for semiconductor package |
Eun-Seok Song, Hee-Seok Lee |
2010-07-20 |
