Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437526 | Chip on film package including distributed via plugs | So-Young Lim, Na-Rae Shin, Jeong-Kyu Ha, Kyoung-Suk Yang | 2016-09-06 |
| 9280182 | Chip on film package and display device including the same | Jeong-Kyu Ha, Kwan-Jai Lee, Jae-Min Jung, Kyong-Soon Cho, Na-Rae Shin +2 more | 2016-03-08 |
| 9059162 | Chip on film (COF) substrate, COF package and display device including the same | Jeong-Kyu Ha, Kwan-Jai Lee, Jae-Min Jung, Kyong-Soon Cho, Na-Rae Shin +2 more | 2015-06-16 |
| 8436462 | Semiconductor housing package, semiconductor package structure including the semiconductor housing package, and processor-based system including the semiconductor package structure | Dong-Han Kim, Sung-Woo Park, Jin-Woo Park, So-Young Lim, Jung-Hwan Kim +1 more | 2013-05-07 |