Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9280182 | Chip on film package and display device including the same | Jeong-Kyu Ha, Jae-Min Jung, Kyong-Soon Cho, Na-Rae Shin, Kyoung-Suk Yang +2 more | 2016-03-08 |
| 9113545 | Tape wiring substrate and chip-on-film package including the same | Sang-Uk Han, Young-Shin Kwon, Jae-Min Jung, Kyong-Soon Cho, Jeong-Kyu Ha | 2015-08-18 |
| 9059162 | Chip on film (COF) substrate, COF package and display device including the same | Jeong-Kyu Ha, Jae-Min Jung, Kyong-Soon Cho, Na-Rae Shin, Kyoung-Suk Yang +2 more | 2015-06-16 |
| 8853694 | Chip on film package including test pads and semiconductor devices including the same | Sang-Uk Han, Jeong-Kyu Ha, Young-Shin Kwon, Seung Hwan Kim | 2014-10-07 |
| 8803301 | Semiconductor package | Kyong-Soon Cho, Seung-Kon Mok, Jae-Min Jung | 2014-08-12 |
| 8629547 | Semiconductor chip package | Kyong-Soon Cho, Chang-Su Kim, Kyoung-Sei Choi, Jae-Hyok Ko, Keung Beum Kim | 2014-01-14 |
| 7339262 | Tape circuit substrate and semiconductor apparatus employing the same | Dae-Woo Son, Sa-Yoon Kang | 2008-03-04 |
| 7247936 | Tape circuit substrate having wavy beam leads and semiconductor chip package using the same | Dae-Woo Son, Jin Hyuk Lee | 2007-07-24 |
| 6878570 | Thin stacked package and manufacturing method thereof | Ju-hyun Lyu, Tae-Je Cho | 2005-04-12 |
| 6849949 | Thin stacked package | Ju-hyun Lyu, Tae-Je Cho | 2005-02-01 |
| 6448661 | Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof | Hyeong-Seob Kim, Sa-Yoon Kang, Myung-Kee Chung, In-Ku Kang | 2002-09-10 |
| 6087722 | Multi-chip package | Young Jae Song, Do Soo Jeong, Tae-Je Cho, Suk Chang, Chang-Cheol Lee +2 more | 2000-07-11 |