Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261135 | Semiconductor packages including antenna pattern | Se-Ho You, Seung-Kon Mok | 2025-03-25 |
| 11626373 | Semiconductor packages including antenna pattern | Se-Ho You, Seung-Kon Mok | 2023-04-11 |
| 9455217 | Semiconductor package including multiple chips and separate groups of leads | Chul-Sung Park, Kun-dae Yeom, Gwang-Man Lim | 2016-09-27 |
| 8901750 | Semiconductor package including multiple chips and separate groups of leads | Chul-Hong Park, Kun-dae Yeom, Gwang-Man Lim | 2014-12-02 |
| 8592997 | Molded underfill flip chip package preventing warpage and void | Hae-Jung Yu, Jong Ho Lee, Jin-Woo Park | 2013-11-26 |
| 8129826 | Semiconductor package apparatus having redistribution layer | Sang Wook Park, Min Young Son | 2012-03-06 |
| 8026616 | Printed circuit board, semiconductor package, card apparatus, and system | Soon-Yong Hur, Mo-rae Kim | 2011-09-27 |
| 7420129 | Semiconductor package including a semiconductor device, and method of manufacturing the same | — | 2008-09-02 |
| 7335592 | Wafer level package, multi-package stack, and method of manufacturing the same | Tae-Gyeong Chung | 2008-02-26 |
| 7105919 | Semiconductor package having ultra-thin thickness and method of manufacturing the same | — | 2006-09-12 |
| 6982487 | Wafer level package and multi-package stack | Tae-Gyeong Chung | 2006-01-03 |
| 6448661 | Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof | Sa-Yoon Kang, Myung-Kee Chung, In-Ku Kang, Kwan-Jai Lee | 2002-09-10 |
| 5898226 | Semiconductor chip having a bonding window smaller than a wire ball | Ki-Kwon Jeong | 1999-04-27 |