Issued Patents All Time
Showing 25 most recent of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9570400 | Semiconductor package | Bo-Na Baek, Seok-Won Lee, Eun-Seok Cho, Dong-Han Kim, Kyoung-Sei Choi | 2017-02-14 |
| 8575746 | Chip on flexible printed circuit type semiconductor package | Si-Hoon Lee, Kyoung-Sei Choi | 2013-11-05 |
| 8250750 | Method for manufacturing tape wiring board | Kyoung-Sei Choi, Yong-Hwan Kwon, Chung-Sun Lee | 2012-08-28 |
| 8222089 | Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same | Kyoung-Sei Choi, Byung-Seo Kim, Young-jae Joo, Ye-Chung Chung, Kyong-Soon Cho +6 more | 2012-07-17 |
| 7999341 | Display driver integrated circuit device, film, and module | Ye-Chung Chung | 2011-08-16 |
| 7948768 | Tape circuit substrate with reduced size of base film | Sang Ho Park, Si-Hoon Lee | 2011-05-24 |
| 7915727 | Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same | Kyoung-Sei Choi, Byung-Seo Kim, Young-jae Joo, Ye-Chung Chung, Kyong-Soon Cho +6 more | 2011-03-29 |
| 7902647 | TAB package connecting host device element | Ye-Chung Chung | 2011-03-08 |
| 7895742 | Method for manufacturing tape wiring board | Kyoung-Sei Choi, Yong-Hwan Kwon, Chung-Sun Lee | 2011-03-01 |
| 7732933 | Semiconductor chip and TAB package having the same | Ye-Chung Chung, Dong-Han Kim | 2010-06-08 |
| 7683471 | Display driver integrated circuit device, film, and module | Ye-Chung Chung | 2010-03-23 |
| 7683476 | Semiconductor package film having reinforcing member and related display module | Si-Hoon Lee, Jae-Cheon Doh | 2010-03-23 |
| 7649246 | Tab package connecting host device element | Ye-Chung Chung | 2010-01-19 |
| 7599193 | Tape circuit substrate with reduced size of base film | Sang Ho Park, Si-Hoon Lee | 2009-10-06 |
| 7405760 | Image pickup device with non-molded DSP chip and manufacturing method | Min Kyo Cho, Young-Hoon Ro, Young-Shin Kwon | 2008-07-29 |
| 7375426 | Semiconductor package | Suk-Chae Kang, Si-Hoon Lee, Dong-Han Kim, Yun-Hyeok Im, Gu-Sung Kim | 2008-05-20 |
| 7339262 | Tape circuit substrate and semiconductor apparatus employing the same | Dae-Woo Son, Kwan-Jai Lee | 2008-03-04 |
| 7329597 | Semiconductor chip and tab package having the same | Ye-Chung Chung, Dong-Han Kim | 2008-02-12 |
| 7315086 | Chip-on-board package having flip chip assembly structure and manufacturing method thereof | Dong-Han Kim, Seok-Won Lee | 2008-01-01 |
| 7309916 | Semiconductor package and method for its manufacture | Suk-Chae Kang, Dong-Han Kim, Si-Hoon Lee | 2007-12-18 |
| 7299547 | Method for manufacturing tape wiring board | Kyoung-Sei Choi, Yong-Hwan Kwon, Chung-Sun Lee | 2007-11-27 |
| 7208343 | Semiconductor chip, chip stack package and manufacturing method | Young-Hee Song, Min Young Son | 2007-04-24 |
| 7190073 | Circuit film with bump, film package using the same, and related fabrication methods | Yong-Hwan Kwon, Chung-Sun Lee, Kyoung-Sei Choi | 2007-03-13 |
| 7183660 | Tape circuit substrate and semicondutor chip package using the same | Si-Hoon Lee, Dong-Han Kim | 2007-02-27 |
| 7115483 | Stacked chip package having upper chip provided with trenches and method of manufacturing the same | Yong-Hwan Kwon, Se-Yong Oh | 2006-10-03 |