| 11315802 |
Method for manufacturing semiconductor package having redistribution layer |
Il Hwan Kim, Un-Byoung Kang |
2022-04-26 |
| 10957833 |
Light emitting diode display device |
Tan Sakong, Yong-Il Kim, Han Kyu Seong, Ji Hye Yeon, Ji Hwan Hwang |
2021-03-23 |
| 9343432 |
Semiconductor chip stack having improved encapsulation |
Jung-Hwan Kim, Tae Hong Kim, Hyun-Jung Song, Sun-Pil Youn |
2016-05-17 |
| 8791562 |
Stack package and semiconductor package including the same |
Jung-Hwan Kim, Yun-Hyeok Im, Ji Hwan Hwang, Hyon-chol Kim, Kwang-chul Choi +2 more |
2014-07-29 |
| 8604615 |
Semiconductor device including a stack of semiconductor chips, underfill material and molding material |
Jung-Hwan Kim, Tae Hong Min, Hyun-Jung Song, Sun-Pil Youn |
2013-12-10 |
| 8250750 |
Method for manufacturing tape wiring board |
Kyoung-Sei Choi, Sa-Yoon Kang, Yong-Hwan Kwon |
2012-08-28 |
| 8114701 |
Camera modules and methods of fabricating the same |
Woon-Seong Kwon, Tae-Je Cho, Yong-Hwan Kwon, Un-Byoung Kang, Hyung-Sun Jang |
2012-02-14 |
| 7948555 |
Camera module and electronic apparatus having the same |
Yong-Hwan Kwon, Un-Byoung Kang, Woon-Seong Kwon, Hyung-Sun Jang |
2011-05-24 |
| 7895742 |
Method for manufacturing tape wiring board |
Kyoung-Sei Choi, Sa-Yoon Kang, Yong-Hwan Kwon |
2011-03-01 |
| 7893514 |
Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package |
Woon-Seong Kwon, Yong-Hwan Kwon, Un-Byoung Kang, Hyung-Sun Jang |
2011-02-22 |
| 7884392 |
Image sensor having through via |
Hyuek Jae Lee, Tae-Je Cho, Yong-Hwan Kwon, Un-Byoung Kang, Woon-Seong Kwon +1 more |
2011-02-08 |
| 7786581 |
Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device |
Un-Byoung Kang, Yong-Hwan Kwon, Woon-Seong Kwon, Hyung-Sun Jang |
2010-08-31 |
| 7619315 |
Stack type semiconductor chip package having different type of chips and fabrication method thereof |
Woon-Seong Kwon, Yong-Hwan Kwon, Un-Byoung Kang, Hyung-Sun Jang |
2009-11-17 |
| 7569423 |
Wafer-level-chip-scale package and method of fabrication |
Yong-Hwan Kwon, Woon-byung Kang |
2009-08-04 |
| 7554201 |
Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same |
Uu-Byung Kang, Yong-Hwan Kwon, Jong Ho Lee |
2009-06-30 |
| 7299547 |
Method for manufacturing tape wiring board |
Kyoung-Sei Choi, Sa-Yoon Kang, Yong-Hwan Kwon |
2007-11-27 |
| 7190073 |
Circuit film with bump, film package using the same, and related fabrication methods |
Yong-Hwan Kwon, Sa-Yoon Kang, Kyoung-Sei Choi |
2007-03-13 |
| 7087987 |
Tape circuit substrate and semiconductor chip package using the same |
Ye-Chung Chung |
2006-08-08 |
| 7078331 |
Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same |
Yong-Hwan Kwon, Sa-Yoon Kang |
2006-07-18 |
