Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7569423 | Wafer-level-chip-scale package and method of fabrication | Yong-Hwan Kwon, Chung-Sun Lee | 2009-08-04 |
WK
Woon-byung Kang
Overall (All Time): #3,331,911 of 4,157,543Top 85%
1
Patents All Time