Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11782466 | Method of dynamic thermal management of electronic device | Myung-Kyoon Yim, Wook KIM, Kyoung Min Lee, Kyung Soo Lee | 2023-10-10 |
| 11658094 | Semiconductor package | Soo-Jeoung Park | 2023-05-23 |
| 11244936 | Semiconductor device package and apparatus comprising the same | Hee-Seok Lee, Taek Kyun Shin, Cha-Jea Jo | 2022-02-08 |
| 11171128 | Semiconductor package | Hee-Seok Lee, Tae Woo KANG, Yeong Seok Kim, Kyoung Min Lee | 2021-11-09 |
| 11119517 | Method of dynamic thermal management of electronic device | Myung-Kyoon Yim, Wook KIM, Kyoung Min Lee, Kyung Soo Lee | 2021-09-14 |
| 10852080 | Controllers, apparatuses, and methods for thermal management using adaptive thermal resistance and thermal capacity | Myung-Kyoon Yim, Kyoung Min Lee, Kyung Soo Lee | 2020-12-01 |
| 10607971 | Semiconductor package | Hee-Seok Lee, Tae Woo KANG, Yeong Seok Kim, Kyoung Min Lee | 2020-03-31 |
| 9666503 | Semiconductor package and electronic system including the same | Kyol Park, Hee-Jung Hwang | 2017-05-30 |
| 9589945 | Semiconductor package having stacked semiconductor chips | Cha-Jea Jo, Tae-Je Cho | 2017-03-07 |
| 9482584 | System and method for predicting the temperature of a device | Kyol Park, Tae-Je Cho | 2016-11-01 |
| 9293389 | Method of manufacturing a semiconductor package including a surface profile modifier | Kyol Park | 2016-03-22 |
| 9076881 | Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package | Jong-Yeon Kim, Tae-Je Cho, Un-Byoung Kang | 2015-07-07 |
| 8921990 | Semiconductor package | Kyol Park | 2014-12-30 |
| 8791562 | Stack package and semiconductor package including the same | Chung-Sun Lee, Jung-Hwan Kim, Ji Hwan Hwang, Hyon-chol Kim, Kwang-chul Choi +2 more | 2014-07-29 |
| 8643179 | Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package | Jong-Yeon Kim, Tae-Je Cho, Un-Byoung Kang | 2014-02-04 |
| 8587134 | Semiconductor packages | Won Keun Kim, Tae-Je Cho, Kyol Park | 2013-11-19 |
| 8104952 | Micro heat flux sensor array | Jae-Wook Yoo | 2012-01-31 |
| 7699520 | Micro heat flux sensor array | Jae-Wook Yoo | 2010-04-20 |
| 7601561 | Heat-radiating tape carrier package and method for manufacturing the same | Dong-Han Kim, Jae-Wook Yoo | 2009-10-13 |
| 7388286 | Semiconductor package having enhanced heat dissipation and method of fabricating the same | Sang-Uk Kim | 2008-06-17 |
| 7375426 | Semiconductor package | Suk-Chae Kang, Si-Hoon Lee, Sa-Yoon Kang, Dong-Han Kim, Gu-Sung Kim | 2008-05-20 |
| 7372148 | Semiconductor chip having coolant path, semiconductor package and package cooling system using the same | Jae-Wook Yoo, Hee-Seok Lee | 2008-05-13 |
| 7081375 | Semiconductor package having thermal interface material (TIM) | Joong-Hyun Baek, Ho-Jeong Moon, Dong-Kil Shin | 2006-07-25 |
| 6891259 | Semiconductor package having dam and method for fabricating the same | Young-Hoon Ro | 2005-05-10 |
| 6835598 | Stacked semiconductor module and method of manufacturing the same | Joong-Hyun Baek, Jin-Yang Lee, Tae-koo Lee | 2004-12-28 |