Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6781849 | Multi-chip package having improved heat spread characteristics and method for manufacturing the same | Joong-Hyun Baek, Tae-koo Lee, Min-ha Kim | 2004-08-24 |
| 6756668 | Semiconductor package having thermal interface material (TIM) | Joong-Hyun Baek, Ho-Jeong Moon, Dong-Kil Shin | 2004-06-29 |