Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217495 | X-ray system, semiconductor package, and tray having X-ray absorption filter | Sang-Young Kim, Kyung-Soo Rho, Hyuck Shin, SUN-NYEONG JUNG | 2022-01-04 |
| 9728293 | X-ray system, semiconductor package, and tray having X-ray absorption filter | Sang-Young Kim, Kyung-Soo Rho, Hyuck Shin, SUN-NYEONG JUNG | 2017-08-08 |
| 8448506 | Adhesion test method using elastic plate | Yeo-Hoon Yoon | 2013-05-28 |
| 7692291 | Circuit board having a heating means and a hermetically sealed multi-chip package | Kyu Jin Lee | 2010-04-06 |
| 7081375 | Semiconductor package having thermal interface material (TIM) | Joong-Hyun Baek, Dong-Kil Shin, Yun-Hyeok Im | 2006-07-25 |
| 6963033 | Ball grid array attaching means having improved reliability and method of manufacturing same | Sang-Young Kim, Dong-Kil Shin, Seung-Kon Mok | 2005-11-08 |
| 6756668 | Semiconductor package having thermal interface material (TIM) | Joong-Hyun Baek, Dong-Kil Shin, Yun-Hyeok Im | 2004-06-29 |
| 6638638 | Hollow solder structure having improved reliability and method of manufacturing same | Sang-Young Kim, Dong-Kil Shin, Seung-Kon Mok | 2003-10-28 |