Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12007695 | Rapid large-scale fabrication of metasurfaces with complex unit cells | Robert Magnusson, Hafez Hemmati, Pawarat Bootpakdeetam | 2024-06-11 |
| 11584251 | Method for displaying charge energy by solar roof system of vehicle | Jung Soo Park, Seung-Wan Son, Dong Jun Shin | 2023-02-21 |
| 10967750 | System and method for charging plug-in hybrid vehicle | Jang Hyo Lee, Sang Hoon Yoo, Chun Hyuk Lee | 2021-04-06 |
| 10877193 | Polarization independent wideband reflectors and methods for their manufacture | Robert Magnusson, Manoj Niraula, Yeong Hwan Ko | 2020-12-29 |
| 10337390 | System and method for charging plug-in hybrid vehicle | Jang Hyo Lee, Sang Hoon Yoo, Chun Hyuk Lee | 2019-07-02 |
| 9722146 | Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing LED package and LED package manufactured thereby | Chang Hoon Kwak, Il Woo Park, Cheol Jun Yoo, Seong Jae Hong | 2017-08-01 |
| 9537068 | Light emitting device package | Hyun-Kwan Yang, Jin Mo KIM, Hyung-jin An | 2017-01-03 |
| 9381959 | Rubber crawler having metal core for improvement of wheel separation and durability | Jung-Ho Park | 2016-07-05 |
| 8795817 | Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing LED package, and LED package manufactured thereby | Chang Hoon Kwak, II Woo Park, Cheol Jun Yoo, Seong Jae Hong | 2014-08-05 |
| 7848218 | Virtual multi-antenna method for OFDM system and OFDM-based cellular system | Hyo Jin Lee, Jae Young Ahn, Yong-Soo Cho, Kyung Won Park | 2010-12-07 |
| D624924 | Dongle for receiving digital TV broadcasting | — | 2010-10-05 |
| 7692291 | Circuit board having a heating means and a hermetically sealed multi-chip package | Ho-Jeong Moon | 2010-04-06 |
| 7245008 | Ball grid array package, stacked semiconductor package and method for manufacturing the same | — | 2007-07-17 |
| 7023096 | Multi-chip package having spacer that is inserted between chips and manufacturing method thereof | Hyung-Jik Byun | 2006-04-04 |
| 6736306 | Semiconductor chip package comprising enhanced pads | Hyung-Jik Byun | 2004-05-18 |
| 6252298 | Semiconductor chip package using flexible circuit board with central opening | Wan Choi | 2001-06-26 |
| 6013946 | Wire bond packages for semiconductor chips and related methods and assemblies | Do Soo Jeong, Jae June Kim | 2000-01-11 |
| 5940680 | Method for manufacturing known good die array having solder bumps | Sang Hyeog Lee, In-ho Hyun, Il Ung Kim | 1999-08-17 |
| 5900676 | Semiconductor device package structure having column leads and a method for production thereof | Young Do Kweon, Wan Gyan Choi | 1999-05-04 |
| 5894107 | Chip-size package (CSP) using a multi-layer laminated lead frame | Do Soo Jeong, Wan Gyan Choi, Tae-Gyeong Chung | 1999-04-13 |
| 5706172 | Stacked semiconductor package having supporting bars and a socket therefor | — | 1998-01-06 |
| 5581195 | Semiconductor chip holding device | Hyeon J. Jeong | 1996-12-03 |