Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5900676 | Semiconductor device package structure having column leads and a method for production thereof | Young Do Kweon, Kyu Jin Lee | 1999-05-04 |
| 5894107 | Chip-size package (CSP) using a multi-layer laminated lead frame | Kyu Jin Lee, Do Soo Jeong, Tae-Gyeong Chung | 1999-04-13 |