Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9685400 | Semiconductor package and method of forming the same | Tae-Joo Hwang, Eun-Chul Ahn | 2017-06-20 |
| 9484292 | Semiconductor package and method of forming the same | Tae-Joo Hwang, Eun-Chul Ahn | 2016-11-01 |
| 8928154 | Semiconductor module | Sun-Won Kang, Young-Hee Song, Nam-Seog Kim, Seung-Duk Baek | 2015-01-06 |
| 8736035 | Semiconductor package and method of forming the same | Tae-Joo Hwang, Eun-Chul Ahn | 2014-05-27 |
| 8431442 | Methods of manufacturing semiconductor chips | Sang Wook Park, Ho-Geon Song, Won-Chul Lim | 2013-04-30 |
| 8421244 | Semiconductor package and method of forming the same | Tae-Joo Hwang, Eun-Chul Ahn | 2013-04-16 |
| 8129221 | Semiconductor package and method of forming the same | Tae-Joo Hwang, Eun-Chul Ahn | 2012-03-06 |
| 8115324 | Semiconductor module | Sun-Won Kang, Young-Hee Song, Nam-Seog Kim, Seung-Duk Baek | 2012-02-14 |
| 8022555 | Semiconductor package and method of forming the same | Tae-Joo Hwang, Eun-Chul Ahn | 2011-09-20 |
| 7923291 | Method of fabricating electronic device having stacked chips | Hae-Jung Yu, Eun-Chul Ahn, Nam-Seog Kim | 2011-04-12 |
| 7821139 | Flip-chip assembly and method of manufacturing the same | Tae-Joo Hwang, Eun-Chul Ahn | 2010-10-26 |
| 7485955 | Semiconductor package having step type die and method for manufacturing the same | In-Ku Kang, Seok Goh, Jin Ho Kim, Yong Jae Lee | 2009-02-03 |
| 7368811 | Multi-chip package and method for manufacturing the same | In-Ku Kang, Sang-Ho An | 2008-05-06 |
| 7335592 | Wafer level package, multi-package stack, and method of manufacturing the same | Hyeong-Seob Kim | 2008-02-26 |
| 6982487 | Wafer level package and multi-package stack | Hyeong-Seob Kim | 2006-01-03 |
| 6943438 | Memory card having a control chip | Min Young Son, Se-Yong Oh | 2005-09-13 |
| 6857470 | Stacked chip package with heat transfer wires | Hee Jin Park, Eun-Chul Ahn | 2005-02-22 |
| 6812578 | Semiconductor device bonding pad resistant to stress and method of fabricating the same | Shin-Hye Kim, Nam-Seog Kim, Woo-Dong Lee, Jin Hyuk Lee | 2004-11-02 |
| 6340838 | Apparatus and method for containing semiconductor chips to identify known good dies | Nam-Seog Kim | 2002-01-22 |
| 5894107 | Chip-size package (CSP) using a multi-layer laminated lead frame | Kyu Jin Lee, Do Soo Jeong, Wan Gyan Choi | 1999-04-13 |
| 5660318 | Apparatus for inner lead bonding (ILB) comprising a heat dissipation pin and method of ILB using such an apparatus | Il Gyu Jung, Tae-koo Lee | 1997-08-26 |