Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496216 | Semiconductor package including stacked semiconductor chips and a redistribution layer | Sung-Hoon Chun, Hye Jin Kim, Kyung-Man Kim, Seok-Chan Lee | 2016-11-15 |
| 9379062 | Semiconductor package | Ki-Hong Jeong, Sang-Sub Song | 2016-06-28 |
| 8838885 | Solid state drive packages and related methods and systems | Dong-ok Kwak, Sang-Sub Song, Joon-young Oh, Jeong-Sik Yoo | 2014-09-16 |
| 8791554 | Substrates for semiconductor devices including internal shielding structures and semiconductor devices including the substrates | Dong-ok Kwak, Sang-Sub Song, Joon-young Oh | 2014-07-29 |
| 7371675 | Method and apparatus for bonding a wire | In-Ku Kang, Sun-Mo Yang | 2008-05-13 |
| 7368811 | Multi-chip package and method for manufacturing the same | In-Ku Kang, Tae-Gyeong Chung | 2008-05-06 |
| 7030489 | Multi-chip module having bonding wires and method of fabricating the same | In-Ku Kang, Hee-Kook Choi, Sang-Yeop Lee | 2006-04-18 |