Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848308 | Semiconductor package | Wansoo Park, Kyung Suk Oh | 2023-12-19 |
| 11791321 | Method of fabricating semiconductor package and semiconductor package | Tae Young Lee, Dongok Kwak, Boseong Kim, Joonyoung Oh | 2023-10-17 |
| 11452206 | Card-type solid state drive | In Jae Lee, Youngdong KIM, Ki-Hong Jeong | 2022-09-20 |
| 11330731 | Memory card socket and electronic apparatus | In Jae Lee | 2022-05-10 |
| 11251169 | Method of fabricating semiconductor package and semiconductor package | Tae Young Lee, Dongok Kwak, Boseong Kim, Joonyoung Oh | 2022-02-15 |
| 10691338 | Data storage device and data processing system including same | Chan Ho Yoon, Nam-wook Kang, Jung-Pil Lee, Tae Young Lee | 2020-06-23 |
| 10074632 | Solid-state drive | Sang Ho Park, Ki-Hong Jeong | 2018-09-11 |
| 9847319 | Solid state drive package and data storage system including the same | Sung-Wook Hwang, Yeoung-Jun Cho, Ki-Hong Jeong, Tae-Heum Kim | 2017-12-19 |
| 9379062 | Semiconductor package | Ki-Hong Jeong, Sang-Ho An | 2016-06-28 |
| 8937370 | Memory device and fabricating method thereof | In-sang Song | 2015-01-20 |
| 8838885 | Solid state drive packages and related methods and systems | Dong-ok Kwak, Sang-Ho An, Joon-young Oh, Jeong-Sik Yoo | 2014-09-16 |
| 8791554 | Substrates for semiconductor devices including internal shielding structures and semiconductor devices including the substrates | Dong-ok Kwak, Sang-Ho An, Joon-young Oh | 2014-07-29 |
| 7375428 | Flip-chip bonding structure using multi chip module-deposited substrate | Kwang-Seok Seo | 2008-05-20 |