Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046546 | Package substrate and semiconductor package including same | Shlege Lee, Sunwoo Han | 2024-07-23 |
| 11791321 | Method of fabricating semiconductor package and semiconductor package | Tae Young Lee, Boseong Kim, Sang-Sub Song, Joonyoung Oh | 2023-10-17 |
| 11315849 | Semiconductor package having stiffener | Suchang LEE | 2022-04-26 |
| 11251169 | Method of fabricating semiconductor package and semiconductor package | Tae Young Lee, Boseong Kim, Sang-Sub Song, Joonyoung Oh | 2022-02-15 |
| 9437518 | Semiconductor module | Jaebum Byun, Heeyoub Kang, Junghoon Kim, Joonyoung Oh, Won-Hwa Lee +2 more | 2016-09-06 |