Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495576 | Semiconductor package | Kyoungsoo Kim, Sunwon Kang, Seungduk Baek, Kyung Suk Oh | 2022-11-08 |
| 10896879 | Semiconductor package having reflective layer with selective transmittance | Kun Sil Lee, Dong Kwan Kim, Bo Ram Kang, Won Keun Kim | 2021-01-19 |
| 10756062 | Semiconductor chip and semiconductor package including the same | Kyoung Soo Kim, Seung-Duk Baek, Sun-Won Kang, Gun-ho Chang | 2020-08-25 |
| 9941196 | Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device | Ho-Jin Lee, Tae-Je Cho, Dong-Hyeon Jang, Se-Young Jeong, Un-Byoung Kang +1 more | 2018-04-10 |
| 9343361 | Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device | Ho-Jin Lee, Tae-Je Cho, Dong-Hyeon Jang, Se-Young Jeong, Un-Byoung Kang +1 more | 2016-05-17 |
| 9184065 | Method of molding semiconductor package | Jun-Young Ko, Jae-Yong Park, Heui-Seog Kim | 2015-11-10 |
| 9159680 | Method of fabricating semiconductor device | Sang Wook Park, Kwang-Yong Lee | 2015-10-13 |
| 9136260 | Method of manufacturing chip-stacked semiconductor package | Jung-Seok Ahn, Dong-Hyeon Jang, Sung-jun Im, Chang-Seong Jeon, Teak-Hoon Lee +1 more | 2015-09-15 |
| 9099460 | Stack semiconductor package and manufacturing the same | Yun-Rae Cho, Tae Hoon Kim, Seok-Won Lee | 2015-08-04 |
| 8956921 | Method of molding semiconductor package | Jun-Young Ko, Jae-Yong Park, Heui-Seog Kim | 2015-02-17 |
| 8927340 | Double-sided adhesive tape, semiconductor packages, and methods of fabricating the same | Jin-Woo Park, Seok Hyun LEE | 2015-01-06 |
| 8890294 | Stack semiconductor package and manufacturing the same | Yun-Rae Cho, Tae Hoon Kim, Seok-Won Lee | 2014-11-18 |
| 8697494 | Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method | Chang-Seong Jeon, Mitsuo Umemoto, Sang-Sick Park | 2014-04-15 |
| 8637969 | Stacked chips in a semiconductor package | Teak-Hoon Lee, Won Keun Kim, Dong-Hyeon Jang, Sung-jun Im | 2014-01-28 |
| 8637350 | Method of manufacturing chip-stacked semiconductor package | Jung-Seok Ahn, Dong-Hyeon Jang, Sung-jun Im, Chang-Seong Jeon, Teak-Hoon Lee +1 more | 2014-01-28 |
| 8592991 | Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device | Ho-Jin Lee, Tae-Je Cho, Dong-Hyeon Jang, Se-Young Jeong, Un-Byoung Kang +1 more | 2013-11-26 |
| 8586477 | Semiconductor apparatus, method of manufacturing the same, and method of manufacturing semiconductor package | Se-Young Jeong, Ho-Jin Lee, Jae-hyun Phee | 2013-11-19 |
| 8455301 | Method of fabricating stacked chips in a semiconductor package | Teak-Hoon Lee, Won Keun Kim, Dong-Hyeon Jang, Sung-jun Im | 2013-06-04 |
| 8431442 | Methods of manufacturing semiconductor chips | Sang Wook Park, Tae-Gyeong Chung, Won-Chul Lim | 2013-04-30 |
| 8420450 | Method of molding semiconductor package | Jun-Young Ko, Jae-Yong Park, Heui-Seog Kim | 2013-04-16 |
| 8193619 | Lead frame and semiconductor package having the same | Geun Woo Kim, Man-hee Han | 2012-06-05 |
| 8189342 | Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly | Hyo-Jae Bang, Dong-Chun Lee, Seong-Chan Han, Kwang-Su Yu, Dong-Woo Shin | 2012-05-29 |
| 8053351 | Method of forming at least one bonding structure | Hwang-Bok Ryu, Ky-Hyun Jung, Jae-Yong Park | 2011-11-08 |
| 8039972 | Printed circuit board and method thereof and a solder ball land and method thereof | Ky-Hyun Jung, Heui-Seog Kim, Sang Jun Kim, Wha-Su Sin, Jun-Young Ko | 2011-10-18 |
| 7576438 | Printed circuit board and method thereof and a solder ball land and method thereof | Ky-Hyun Jung, Heui-Seog Kim, Sang Jun Kim, Wha-Su Sin, Jun-Young Ko | 2009-08-18 |