Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081425 | Semiconductor packages | Seung-Duk Baek | 2021-08-03 |
| 10872802 | Method of debonding a carrier substrate from a device substrate, apparatus for performing the same, and method of singulating semiconductor chips including the same | Myung-Kee Chung | 2020-12-22 |
| 10756062 | Semiconductor chip and semiconductor package including the same | Kyoung Soo Kim, Seung-Duk Baek, Sun-Won Kang, Ho-Geon Song | 2020-08-25 |
| 10026724 | Semiconductor package and method of manufacturing the same | Ji Hwang Kim, Jong Bo Shim, Sang-Uk Han, Cha-Jea Jo | 2018-07-17 |
| 9966364 | Semiconductor package and method for fabricating the same | Jong Bo Shim, Cha-Je Jo | 2018-05-08 |
| 9899337 | Semiconductor package and manufacturing method thereof | Tae-Je Cho, Jong Bo Shim | 2018-02-20 |
| 9761477 | Pre-package and methods of manufacturing semiconductor package and electronic device using the same | Un-Byoung Kang, Tae-Je Cho | 2017-09-12 |
| 9478514 | Pre-package and methods of manufacturing semiconductor package and electronic device using the same | Un-Byoung Kang, Tae-Je Cho | 2016-10-25 |