Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8156636 | Apparatus to manufacture a semiconductor package having a buffer disposed adjacent to a process unit of the apparatus | Goon-Woo Kim, Whasu Sin, Jae-Yong Park | 2012-04-17 |
| 8053351 | Method of forming at least one bonding structure | Ky-Hyun Jung, Jae-Yong Park, Ho-Geon Song | 2011-11-08 |