Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053351 | Method of forming at least one bonding structure | Hwang-Bok Ryu, Jae-Yong Park, Ho-Geon Song | 2011-11-08 |
| 8039972 | Printed circuit board and method thereof and a solder ball land and method thereof | Heui-Seog Kim, Sang Jun Kim, Wha-Su Sin, Ho-Geon Song, Jun-Young Ko | 2011-10-18 |
| 7576438 | Printed circuit board and method thereof and a solder ball land and method thereof | Heui-Seog Kim, Sang Jun Kim, Wha-Su Sin, Ho-Geon Song, Jun-Young Ko | 2009-08-18 |
| 7102369 | Contact pin, connection device and method of testing | — | 2006-09-05 |