| 8115323 |
Semiconductor package and method of manufacturing the semiconductor package |
Heui-Seog Kim, Jong-Keun Jeon |
2012-02-14 |
| 8039972 |
Printed circuit board and method thereof and a solder ball land and method thereof |
Ky-Hyun Jung, Heui-Seog Kim, Sang Jun Kim, Ho-Geon Song, Jun-Young Ko |
2011-10-18 |
| 7863161 |
Method of cutting a wafer |
Dae-Sang Chan, Jun-Young Ko, Jae-Yong Park |
2011-01-04 |
| 7745932 |
Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same |
Jun-Young Ko, Dae-Sang Chan, Jae-Yong Park, Heui-Seog Kim |
2010-06-29 |
| 7713788 |
Method of manufacturing semiconductor package using redistribution substrate |
Jun-Young Ko, Dae-Sang Chan, Heui-Seog Kim, Jae-Yong Park |
2010-05-11 |
| 7696615 |
Semiconductor device having pillar-shaped terminal |
Jun-Young Ko, Dae-Sang Chan |
2010-04-13 |
| 7576438 |
Printed circuit board and method thereof and a solder ball land and method thereof |
Ky-Hyun Jung, Heui-Seog Kim, Sang Jun Kim, Ho-Geon Song, Jun-Young Ko |
2009-08-18 |
| 7452753 |
Method of processing a semiconductor wafer for manufacture of semiconductor device |
Dae-sang Chun, Jae Hong Kim, Heui-Seog Kim, Jong-Keun Jeon |
2008-11-18 |
| 7427558 |
Method of forming solder ball, and fabricating method and structure of semiconductor package using the same |
Jae Hong Kim, Heui-Seog Kim, Jong-Keun Jeon |
2008-09-23 |
| 7420814 |
Package stack and manufacturing method thereof |
Jae Hong Kim, Heui-Seog Kim, Jong-Keun Jeon |
2008-09-02 |
| 7235887 |
Semiconductor package with improved chip attachment and manufacturing method thereof |
Jong-Ung Lee, Jong-Keun Jeon |
2007-06-26 |
